Chip-based silica microspheres for cavity optomechanics

被引：0
|
作者：
Jiang, Xuefeng [1 ]
Kuzyk, Mark
Oo, Thein
Wang, Hailin
机构：
[1] Univ Oregon, Dept Phys, Eugene, OR 97403 USA
来源：
2015 CONFERENCE ON LASERS AND ELECTRO-OPTICS (CLEO) | 2015年
关键词：
MODE;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We realized on-chip silica microspheres, featuring excellent thermal coupling to the silicon-wafer. These chip-based microspheres can overcome the problem of thermal bistability and are especially suitable for optomechanical studies in vacuum or at low temperature.
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页数：2
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