Study on atom diffusion under the treatment by pulse current heating

被引：16

作者：

Wang Kun ^{[1
]}

Tan Tianya ^{[1
]}

Fu Zhengyi ^{[1
]}

Zhang Jinyong ^{[1
]}

Wang Yucheng ^{[1
]}

Wang Weimin ^{[1
]}

Zhang Qingjie ^{[1
]}

机构：

[1] Wuhan Univ Technol, State Key Lab Adv Technol Mat Synth & Proc, Wuhan 430070, Peoples R China

来源：

MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY | 2006年 / 135卷 / 02期

关键词：

pulse current heating; atom diffusion; metal;

D O I：

10.1016/j.mseb.2006.08.059

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this paper, experiments were performed to study the effects of processing temperature, heating rate, ON/OFF, methods of specimen placed in the die on atom diffusion at the interface of Cu/Ni materials under pulse current heating (PCH). Under identical conditions of the processing temperature, experiments were carried out to compare atom diffusion at the interface between the flake metal, the contacting line between strip metal, and the neck among sphere metal particles under PCH and radiation heating. Results indicated that atom diffusion is faster under PCH. (c) 2006 Elsevier B.V. All rights reserved.

引用

页码：154 / 161

页数：8

共 11 条

[1] RECRYSTALLIZATION AND GRAIN GROWTH [J].

BURKE, JE ;

TURNBULL, D .

PROGRESS IN METAL PHYSICS, 1952, 3 :220-292

[2]

Coblenz W., 1980, MAT SCI RES, V13, P141

[3]

Crank J., 1979, MATH DIFFUSION

[4]

Frenkel J., 1945, J. Phys. (USSR), V9, P385

[5] Pulsed current sintering of mechanically alloyed Ni-Ti powder [J].

Kobayashi, K ;

Matsumoto, A ;

Ozaki, K ;

Sugiyama, A ;

Nishio, T .

JOURNAL OF THE JAPAN INSTITUTE OF METALS, 1999, 63 (09) :1161-1164

[6]

Oh ST, 2000, J AM CERAM SOC, V83, P1314

[7] Formation of tough interlocking microstructures in silicon nitride ceramics by dynamic ripening [J].

Shen, ZJ ;

Zhao, Z ;

Peng, H ;

Nygren, M .

NATURE, 2002, 417 (6886) :266-269

[8]

Tokita M., 1993, J JAPAN SOC POWDER P, V30, P790, DOI [DOI 10.4164/SPTJ.30.790, 10.4164/sptj.30.11_790, DOI 10.4164/SPTJ.30.11_790]

[9] Effect of plasma activated sintering (PAS) parameters on densification of copper powder [J].

Wang, SW ;

Chen, LD ;

Kang, YS ;

Niino, M ;

Hirai, T .

MATERIALS RESEARCH BULLETIN, 2000, 35 (04) :619-628

[10]

Wang YC, 2002, MAT SCI ENG B-SOLID, V90, P34, DOI 10.1016/S0921-5107(01)00780-2

← 1 2 →