Thermal Analysis of the Sn-Ag-Cu-In Solder Alloy

被引：21

作者：

Sopousek, Jiri ^{[1
]}

Palcut, Marian ^{[2
,4
]}

Hodulova, Erika ^{[3
]}

Janovec, Jozef ^{[2
]}

机构：

[1] Masaryk Univ, Fac Sci, Inst Chem, CS-61137 Brno, Czech Republic

[2] Slovak Univ Technol, Inst Mat Sci, Fac Mat Sci & Technol, Trnava 91724, Slovakia

[3] Slovak Univ Technol, Fac Mat Sci & Technol, Inst Prod Technol, Trnava 91724, Slovakia

[4] Tech Univ Denmark, Div Fuel Cells & Solid State Chem, Riso Natl Lab Sustainable Energy, DK-4000 Roskilde, Denmark

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2010年 / 39卷 / 03期

关键词：

Lead-free soldering; solidification; CALPHAD; DSC simulation; PHASE-EQUILIBRIA; THERMODYNAMIC CALCULATION; SURFACE-TENSION; DIAGRAM; CALC;

D O I：

10.1007/s11664-009-1070-2

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The tin-based alloy Sn-1.5Ag-0.7Cu-9.5In (composition in wt.%) is a potential candidate for lead-free soldering at temperatures close to 200A degrees C due to the significant amount of indium. Samples of Sn-1.5Ag-0.7Cu-9.5In were prepared by controlled melting of the pure elements, followed by quenching to room temperature. The samples were analyzed by scanning electron microscopy/energy-dispersive x-ray spectroscopy (SEM/EDS) and electron backscatter diffraction. The solidified melt consisted of four different phases. Solidification behavior was monitored by heat-flux differential scanning calorimetry (DSC). The phase equilibrium has been further investigated by thermodynamic calculations. The observed phase compositions as well as DSC signals are reasonably explained using the calculation of phase diagrams (CALPHAD) approach.

引用

页码：312 / 317

页数：6

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