Past, present, and future of InP-based photonic integration

被引：250

作者：

Smit, Meint ^{[1
]}

Williams, Kevin ^{[1
]}

van der Tol, Jos ^{[1
]}

机构：

[1] Tech Univ Eindhoven, COBRA Inst, Inst Photon Integrat, Flux Bldg,POB 513, NL-5600 MB Eindhoven, Netherlands

来源：

APL PHOTONICS | 2019年 / 4卷 / 05期

基金：

欧盟地平线“2020”;

关键词：

LITHOGRAPHY; DEGRADATION; MODULATION; OPTICS;

D O I：

10.1063/1.5087862

中图分类号：

O43 [光学];

学科分类号：

070207 ; 0803 ;

摘要：

The application market for Photonic Integrated Circuits (PICs) is rapidly growing. Photonic integration is the dominant technology in high bandwidth communications and is set to become dominant in many fields of photonics, just like microelectronics in the field of electronics. PICs offer compelling performance advances in terms of precision, bandwidth, and energy efficiency. To enable uptake in new sectors, the availability of highly standardized (generic) photonic integration platform technologies is of key importance as this separates design from technology, reducing barriers for new entrants. The major platform technologies today are Indium Phosphide (InP)-based monolithic integration and Silicon Photonics. In this perspective paper, we will describe the current status and future developments of InP-based generic integration platforms. (c) 2019 Author(s). All article content, except where otherwise noted, is licensed under a Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).

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页数：10

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