Plating structure and antioxygenation of micron Cu-Ag bimetallic powder

被引：11

作者：

Gao, BJ ^{[1
]}

Gao, JF ^{[1
]}

Jiang, HM ^{[1
]}

Zhang, ZX ^{[1
]}

机构：

[1] N China Inst Technol, Dept Chem Engn, Taiyuan 030051, Peoples R China

来源：

ACTA PHYSICO-CHIMICA SINICA | 2000年 / 16卷 / 04期

关键词：

Cu-Ag bimetallic powder; surface structure; oxidation resistance;

D O I：

10.3866/PKU.WHXB20000414

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

The correlation of plating structure with the antioxygenation of micro Cu-Ag bimetallic powder was studied by SEM, XRD, TG and other means, It was found that copper powder plated with silver having an interspersion structure posesses antioxygenation at normal atmospheric temperature as surface Ag content reaches above 15, 22%, the temperature of oxidation resistance varies with the surface Ag content, The greater the surface Ag content is, the higher the temperature of antioxygenation for bimetalic powder with the plating interspersion structure, The copper powder plated by silver with full packaging structure can not be oxidized even at 700 degrees C.

引用

页码：366 / 369

页数：4