Numerical simulation of corrosion process with two-step charge transfer mechanism in the Cu/CuSO4+H2SO4 system

被引：4
|
作者：
Zelinsky, A. G. [1 ]
Pirogov, B. Ya. [1 ]
机构：
[1] Russian Acad Sci, Inst Solid State Chem, Novosibirsk 630128, Russia
来源：
CORROSION SCIENCE | 2006年 / 48卷 / 10期
关键词：
copper; acid solution; modelling studies;
D O I：
10.1016/j.corsci.2005.11.006
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The corrosion process in the CU/CUSO4+H2SO4 system is considered as the sum of two coupled single-electron electrochemical reactions that occur simultaneously and independently on the surface of the copper electrode. Our numerical model incorporates diffusion and migration of solution species including cuprous ions, as well as the chemical equilibria for copper sulphate and sulphuric acid dissociation. Numerical simulations are compared with the trends discovered during experimental investigation of copper corrosion in similar systems. (c) 2005 Elsevier Ltd. All rights reserved.
引用
收藏
页码：2867 / 2881
页数：15
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