Enhancement of solder properties of Sn-9Zn lead-free solder alloy

被引:13
作者
Kamal, M.
Gouda, E. S. [1 ]
机构
[1] Mansoura Univ, Fac Sci, Dept Phys, Met Phys Lab, Mansoura, Egypt
[2] Natl Res Ctr, Met Phys Lab, Dept Solid State, Giza, Egypt
关键词
lead-free solder; X-ray; melting point; wetting; resistivity;
D O I
10.1002/crat.200610751
中图分类号
O7 [晶体学];
学科分类号
0702 ; 070205 ; 0703 ; 080501 ;
摘要
The eutectic alloy Sn-9Zn was considered as a potential alternative to lead-tin solder alloys when compared with other solders. In this paper, ternary, quaternary and penternary additions of the elements Bi, Cu and In were added to the eutectic alloy as a trial to improve its properties. The results showed that, the penternary alloy has properties superior to those of the binary, ternary and quaternary alloys. The alloy of composition Sn-9Zn-1Bi-2Cu-2In has the most suitable properties as a candidate alloy for lead-free solder. It has a lower melting point, 186 degrees C, which is very close to that of Sn-37Pb solder, a lower value of electrical resistivity, 16.5 mu ohm.cm, compared with that of Sn-37Pb (17 mu ohm.cm), higher value of the Young's modulus, 47 GPa, compared with 45 GPa of Sn-37Pb and a higher value of the Vickers hardness, 191 MPa, compared with 129 MPa of Sn-37Pb eutectic alloy. (c) 2006 WILEY-VCH Verlag GmbH & Co. KGaA.
引用
收藏
页码:1210 / 1213
页数:4
相关论文
共 50 条
[41]   Wettability of Sn-Zn-Bi Based Lead-Free Solder with Rare Earths [J].
Zhang Jiangang Huang Jihua Dai Zhifeng Zhang Hua Zhao Xingke School of Materials Science and Engineering University of Science and Technology Beijing Beijing China .
JournalofRareEarths, 2006, (05) :632-632
[42]   Phase diagram of Sn-In-Zn system and its use for lead-free solder [J].
Zheng, YJ ;
Zhang, QY .
ACTA PHYSICO-CHIMICA SINICA, 1998, 14 (12) :1098-1103
[43]   Creep properties and microstructure of the Sn-Ag-Cu-Ni-Ge lead-free solder alloy [J].
Hidaka, Noboru ;
Nagano, Megumi ;
Shimoda, Masayoshi ;
Watanabe, Hirohiko ;
Ono, Masahiro .
ADVANCES IN ELECTRONIC PACKAGING 2005, PTS A-C, 2005, :1805-1810
[44]   Nanoparticles of SnAgCu lead-free solder alloy with an equivalent melting temperature of SnPb solder alloy [J].
Gao, Yulai ;
Zou, Changdong ;
Yang, Bin ;
Zhai, Qijie ;
Liu, Johan ;
Zhuravlev, Evgeny ;
Schick, Christoph .
JOURNAL OF ALLOYS AND COMPOUNDS, 2009, 484 (1-2) :777-781
[45]   Thermal properties and phase stability of Zn-Sn and Zn-In alloys as high temperature lead-free solder [J].
Lee, Jae-Ean ;
Kim, Keun-Soo ;
Suganuma, Katsuaki ;
Inoue, Masahiro ;
Izuta, Goro .
MATERIALS TRANSACTIONS, 2007, 48 (03) :584-593
[46]   Local and Global Properties of a Lead-Free Solder [J].
Z. Ma ;
F. Chalon ;
R. Leroy ;
N. Ranganathan ;
B.D. Beake .
Journal of Electronic Materials, 2014, 43 :658-670
[47]   Effects of small addition of Ag and/or Cu on the microstructure and properties of Sn-9Zn lead-free solders [J].
El-Daly, A. A. ;
Hammad, A. E. .
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2010, 527 (20) :5212-5219
[48]   Local and Global Properties of a Lead-Free Solder [J].
Ma, Z. ;
Chalon, F. ;
Leroy, R. ;
Ranganathan, N. ;
Beake, B. D. .
JOURNAL OF ELECTRONIC MATERIALS, 2014, 43 (03) :658-670
[49]   Design and Properties of New Lead-Free Solder Joints Using Sn-3.5Ag-Cu Solder [J].
Rizk Mostafa Shalaby ;
Mustafa Kamal ;
Esmail Abdo Mohammed Ali ;
Mohammed S. Gumaan .
Silicon, 2018, 10 :1861-1871
[50]   Effects of Yttrium Addition on the Microstructure Evolution and Electrochemical Corrosion of SN-9Zn Lead-Free Solders Alloy [J].
Yang, Wenchao ;
Mao, Jun ;
Ma, Yueyuan ;
Yu, Shuyuan ;
He, Hongping ;
Qi, Da ;
Zhan, Yongzhong .
MATERIALS, 2021, 14 (10)