Enhancement of solder properties of Sn-9Zn lead-free solder alloy

被引：13

作者：

Kamal, M.

Gouda, E. S. ^{[1
]}

机构：

[1] Mansoura Univ, Fac Sci, Dept Phys, Met Phys Lab, Mansoura, Egypt

[2] Natl Res Ctr, Met Phys Lab, Dept Solid State, Giza, Egypt

来源：

CRYSTAL RESEARCH AND TECHNOLOGY | 2006年 / 41卷 / 12期

关键词：

lead-free solder; X-ray; melting point; wetting; resistivity;

D O I：

10.1002/crat.200610751

中图分类号：

O7 [晶体学];

学科分类号：

0702 ; 070205 ; 0703 ; 080501 ;

摘要：

The eutectic alloy Sn-9Zn was considered as a potential alternative to lead-tin solder alloys when compared with other solders. In this paper, ternary, quaternary and penternary additions of the elements Bi, Cu and In were added to the eutectic alloy as a trial to improve its properties. The results showed that, the penternary alloy has properties superior to those of the binary, ternary and quaternary alloys. The alloy of composition Sn-9Zn-1Bi-2Cu-2In has the most suitable properties as a candidate alloy for lead-free solder. It has a lower melting point, 186 degrees C, which is very close to that of Sn-37Pb solder, a lower value of electrical resistivity, 16.5 mu ohm.cm, compared with that of Sn-37Pb (17 mu ohm.cm), higher value of the Young's modulus, 47 GPa, compared with 45 GPa of Sn-37Pb and a higher value of the Vickers hardness, 191 MPa, compared with 129 MPa of Sn-37Pb eutectic alloy. (c) 2006 WILEY-VCH Verlag GmbH & Co. KGaA.

引用

页码：1210 / 1213

页数：4

共 9 条

[1] Intermetallic compounds formed at the interface between Cu substrate and an Sn-9Zn-0.5Ag lead-free solder [J].