Effects of sintering temperature on dihedral angle of NiTiCu SMA fabricated using spark plasma sintering

被引：1

作者：

Velmurugan, C. ^{[1
]}

Kesavan, J. ^{[2
]}

Senthilkumar, V ^{[3
]}

Ramya, K. ^{[4
]}

机构：

[1] Indian Inst Informat Technol, Dept Mech Engn, Tiruchirappalli 620015, Tamil Nadu, India

[2] Periyar Maniammai Inst Sci & Technol, Dept Mech Engn, Tanjore 613403, Tamil Nadu, India

[3] Natl Inst Technol, Dept Prod Engn, Tiruchirappalli 620015, Tamil Nadu, India

[4] Presidency Univ, Dept Elect Engn, Bengaluru 560064, Karnataka, India

来源：

MATERIALS TODAY-PROCEEDINGS | 2021年 / 43卷

关键词：

Spark plasma sintering; NiTiCu; Shape memory alloy; Dihedral angle; GRAIN-BOUNDARY ENERGY; TRIPLE JUNCTIONS; BEHAVIOR; KINETICS; GROWTH;

D O I：

10.1016/j.matpr.2020.12.027

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Applications of shape memory alloys can be designated based on the transformation temperatures which could be dominated by the chemical composition of nickel, processing temperature and secondary phase precipitates. The existence of secondary phase precipitates can be mainly affected by the grain surface and boundary energy which could be calculated by the dihedral angle. In this work, nickel-titanium-copper shape memory alloy has been fabricated using spark plasma sintering technique at various temperatures such as 700 degrees C, 800 degrees C and 900 degrees C. The influence of sintering temperature has been investigated on the occurrence of dihedral angle. Grain boundary and surface energy have been suppressed while energy of triple junctions has been improved with the sintering temperature. The reason behind this was observed by the enhancement of fraction of triple junctions with dihedral angle. Results suggest that the dihedral angle can be improved with the sintering temperature which led to enhance the density of the NiTiCu SMA. (C) 2020 Elsevier Ltd. All rights reserved.

引用

页码：520 / 523

页数：4

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