Surface wettability is known to have a major influence on the ebullition characteristics of a bubble growing from a solid surface. Yet, simplistic static characterization of the wetting behavior is still relied upon to indicate performance characteristics during boiling. In this study, a theoretical framework is developed for the wetting and dewetting processes occurring during bubble growth based upon the dynamic contact angles. This framework is incorporated into adiabatic volume-of-fluid simulations to capture the influence of the surface wettability on contact line and contact angle dynamics during bubble growth and departure. The simulations span a large range of dynamic wetting behaviors and fluid properties. The receding contact angle is shown to govern the early stages of bubble growth as the contact line recedes outward from the bubble center and is the dominant wetting characteristic that determines the maximum contact diameter and departure size. The advancing contact angle dictates the departure morphology as the contact line retracts inward and has a secondary role in determining the departure size. Following, improved reduced-order models are developed that establish fluid-property-independent correlations for the maximum contact diameter and departure diameter as a function of the dynamic contact angles. The results call for the need to redefine wettability classifications based on dynamic contact angles rather than static contact angle in the context of boiling. Hygrophilicity and hygrophobicity are redefined in this context, and an additional classification, ambiphilicity, is introduced for boiling surfaces exhibiting low receding contact angles and high advancing contact angles. (C) 2021 Elsevier Ltd. All rights reserved.
机构:
Purdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
Purdue Univ, Birck Nanotechnol Ctr, W Lafayette, IN 47907 USAPurdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
Allred, Taylor P.
;
Weibel, Justin A.
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机构:
Purdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
Purdue Univ, Birck Nanotechnol Ctr, W Lafayette, IN 47907 USAPurdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
Weibel, Justin A.
;
Garimella, Suresh, V
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机构:
Purdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
Purdue Univ, Birck Nanotechnol Ctr, W Lafayette, IN 47907 USAPurdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
机构:
Northwestern Univ, Robert R McCormick Sch Engn & Appl Sci, Dept Biomed Engn, Evanston, IL 60208 USANorthwestern Univ, Robert R McCormick Sch Engn & Appl Sci, Dept Biomed Engn, Evanston, IL 60208 USA
Cavanagh, DP
;
Eckmann, DM
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机构:Northwestern Univ, Robert R McCormick Sch Engn & Appl Sci, Dept Biomed Engn, Evanston, IL 60208 USA
机构:
City Univ Hong Kong, Dept Mech & Biomed Engn, Hong Kong 999077, Hong Kong, Peoples R ChinaCity Univ Hong Kong, Dept Mech & Biomed Engn, Hong Kong 999077, Hong Kong, Peoples R China
Chen, Xuemei
;
Wu, Jun
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Hong Kong Univ Sci & Technol, Dept Mech Engn, Hong Kong 999077, Hong Kong, Peoples R ChinaCity Univ Hong Kong, Dept Mech & Biomed Engn, Hong Kong 999077, Hong Kong, Peoples R China
Wu, Jun
;
Ma, Ruiyuan
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Hong Kong Univ Sci & Technol, Dept Mech Engn, Hong Kong 999077, Hong Kong, Peoples R ChinaCity Univ Hong Kong, Dept Mech & Biomed Engn, Hong Kong 999077, Hong Kong, Peoples R China
Ma, Ruiyuan
;
Hua, Meng
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City Univ Hong Kong, Dept Mech & Biomed Engn, Hong Kong 999077, Hong Kong, Peoples R ChinaCity Univ Hong Kong, Dept Mech & Biomed Engn, Hong Kong 999077, Hong Kong, Peoples R China
Hua, Meng
;
Koratkar, Nikhil
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机构:
Rensselaer Polytech Inst, Dept Mech Engn, Troy, NY 12180 USA
Rensselaer Polytech Inst, Dept Mat Sci & Engn, Troy, NY 12180 USACity Univ Hong Kong, Dept Mech & Biomed Engn, Hong Kong 999077, Hong Kong, Peoples R China
Koratkar, Nikhil
;
Yao, Shuhuai
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Hong Kong Univ Sci & Technol, Dept Mech Engn, Hong Kong 999077, Hong Kong, Peoples R ChinaCity Univ Hong Kong, Dept Mech & Biomed Engn, Hong Kong 999077, Hong Kong, Peoples R China
Yao, Shuhuai
;
Wang, Zuankai
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h-index: 0
机构:
City Univ Hong Kong, Dept Mech & Biomed Engn, Hong Kong 999077, Hong Kong, Peoples R ChinaCity Univ Hong Kong, Dept Mech & Biomed Engn, Hong Kong 999077, Hong Kong, Peoples R China
机构:
Purdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
Purdue Univ, Birck Nanotechnol Ctr, W Lafayette, IN 47907 USAPurdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
Allred, Taylor P.
;
Weibel, Justin A.
论文数: 0引用数: 0
h-index: 0
机构:
Purdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
Purdue Univ, Birck Nanotechnol Ctr, W Lafayette, IN 47907 USAPurdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
Weibel, Justin A.
;
Garimella, Suresh, V
论文数: 0引用数: 0
h-index: 0
机构:
Purdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
Purdue Univ, Birck Nanotechnol Ctr, W Lafayette, IN 47907 USAPurdue Univ, Sch Mech Engn, W Lafayette, IN 47907 USA
机构:
Northwestern Univ, Robert R McCormick Sch Engn & Appl Sci, Dept Biomed Engn, Evanston, IL 60208 USANorthwestern Univ, Robert R McCormick Sch Engn & Appl Sci, Dept Biomed Engn, Evanston, IL 60208 USA
Cavanagh, DP
;
Eckmann, DM
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h-index: 0
机构:Northwestern Univ, Robert R McCormick Sch Engn & Appl Sci, Dept Biomed Engn, Evanston, IL 60208 USA
机构:
City Univ Hong Kong, Dept Mech & Biomed Engn, Hong Kong 999077, Hong Kong, Peoples R ChinaCity Univ Hong Kong, Dept Mech & Biomed Engn, Hong Kong 999077, Hong Kong, Peoples R China
Chen, Xuemei
;
Wu, Jun
论文数: 0引用数: 0
h-index: 0
机构:
Hong Kong Univ Sci & Technol, Dept Mech Engn, Hong Kong 999077, Hong Kong, Peoples R ChinaCity Univ Hong Kong, Dept Mech & Biomed Engn, Hong Kong 999077, Hong Kong, Peoples R China
Wu, Jun
;
Ma, Ruiyuan
论文数: 0引用数: 0
h-index: 0
机构:
Hong Kong Univ Sci & Technol, Dept Mech Engn, Hong Kong 999077, Hong Kong, Peoples R ChinaCity Univ Hong Kong, Dept Mech & Biomed Engn, Hong Kong 999077, Hong Kong, Peoples R China
Ma, Ruiyuan
;
Hua, Meng
论文数: 0引用数: 0
h-index: 0
机构:
City Univ Hong Kong, Dept Mech & Biomed Engn, Hong Kong 999077, Hong Kong, Peoples R ChinaCity Univ Hong Kong, Dept Mech & Biomed Engn, Hong Kong 999077, Hong Kong, Peoples R China
Hua, Meng
;
Koratkar, Nikhil
论文数: 0引用数: 0
h-index: 0
机构:
Rensselaer Polytech Inst, Dept Mech Engn, Troy, NY 12180 USA
Rensselaer Polytech Inst, Dept Mat Sci & Engn, Troy, NY 12180 USACity Univ Hong Kong, Dept Mech & Biomed Engn, Hong Kong 999077, Hong Kong, Peoples R China
Koratkar, Nikhil
;
Yao, Shuhuai
论文数: 0引用数: 0
h-index: 0
机构:
Hong Kong Univ Sci & Technol, Dept Mech Engn, Hong Kong 999077, Hong Kong, Peoples R ChinaCity Univ Hong Kong, Dept Mech & Biomed Engn, Hong Kong 999077, Hong Kong, Peoples R China
Yao, Shuhuai
;
Wang, Zuankai
论文数: 0引用数: 0
h-index: 0
机构:
City Univ Hong Kong, Dept Mech & Biomed Engn, Hong Kong 999077, Hong Kong, Peoples R ChinaCity Univ Hong Kong, Dept Mech & Biomed Engn, Hong Kong 999077, Hong Kong, Peoples R China