Reliability and Performance Issues in SiC MOSFETs: Insight Provided by Spin Dependent Recombination

被引:2
作者
Ashton, James P. [1 ]
Lenahan, Patrick M. [1 ]
Lichtenwalner, Daniel J. [2 ]
Lelis, Aivars J. [3 ]
Anders, Mark. A. [4 ]
机构
[1] Penn State Univ, Dept Engn Sci & Mech, 227 Hammond Bldg, University Pk, PA 16802 USA
[2] Wolfspeed, Power & Res & Dev, Res Triangle Pk, NC USA
[3] US Army, Power Components Branch, Res Lab, Adelphi, MD USA
[4] NIST, Nanoscale Device Characterizat Div, Gaithersburg, MD 20899 USA
来源
2019 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS) | 2019年
关键词
MOSFETs; EDMR; Reliability; SiC; BAE; MODEL;
D O I
10.1109/irps.2019.8720423
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this work, we utilize electrically detected magnetic resonance via the bipolar amplification effect to explore the physical and chemical nature of defects at the 4H-SiC/SiO2 interface in metal-oxide-semiconductor field effect transistors. Defects at and very near the 4H-SiC/SiO2 interface are involved in bias temperature instabilities in 4H-SiC transistor technology. Of particular relevance to reliability physics, our results indicate that oxygen deficient silicon atoms in the near-interface oxide, known as E' centers, can be greatly reduced utilizing nitric oxide and barium annealing. E' centers have been directly linked to bias temperature instabilities in 4H-SiC technology.
引用
收藏
页数:5
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