Tenacious Hardware Trojans Due to High Temperature in Middle Tiers of 3-D ICs

被引:0
作者
Hasan, Syed Raja [1 ]
Mossa, Siraj Fulum [1 ]
Elkeelany, Omar Sayed Ahmed [1 ]
Awwad, Falah [2 ]
机构
[1] Tennessee Technol Univ, Dept Elecr & Comp Engn Univ, Cookeville, TN USA
[2] United Arab Emirates Univ, Coll Engn, Al Ain, U Arab Emirates
来源
2015 IEEE 58TH INTERNATIONAL MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS (MWSCAS) | 2015年
关键词
3-D IC; hardware Trojan; high temperature;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Hardware security is a major concern in the intellectual property (IP) centric integrated circuits (IC). 3-D IC design augments IP centric designs. However, 3-D ICs suffer from high temperatures in their middle tiers due to long heat dissipation paths. We anticipate that this problem would exacerbate the hardware security issues in 3-D ICs. Because, high temperature leads to undesired timing characteristics in ICs. In this paper we provide a detailed analysis on how these delay variations can lead to non-ideal behavior of control paths. It is demonstrated that a hardware intruder can leverage this phenomenon to trigger the payload, without requiring a separate triggering circuit. Our simulation results show that a state machine can lead to temporary glitches long enough to cause malfunctioning at temperatures of 87 degrees C or above, under nominal frequencies. The overall area overhead of the payload compared to a very small Mod-3 counter is 6%.
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页数:4
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