Polishing Damages to Electrical Properties of BLT Thin Film Capacitors Fabricated by Damascene Process of Chemical Mechanical Polishing

被引：0
|
作者：
Kim, Nam-Hoon [2 ]
Jung, Pan-Gum [1 ]
Ko, Pil-Ju [1 ]
Lee, Woo-Sun [1 ]
机构：
[1] Chosun Univ, Dept Elect Engn, Kwangju 501759, South Korea
[2] Sungkyunkwan Univ, Sch Informat & Commun Engn, Suwon 440746, South Korea
来源：
2008 17TH IEEE INTERNATIONAL SYMPOSIUM ON THE APPLICATIONS OF FERROELECTRICS | 2008年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
BLT thin film capacitor was fabricated by the novel method of chemical mechanical polishing (CMP) process. The electrical characteristics including P-V and I-V of BLT capacitor were damaged by the polishing pressure which is one of the main factors to improve the CMP performance for BLT thin film; therefore, the lower polishing pressure must be selected for the good electrical characteristics although the removal rate was lower.
引用
收藏
页码：208 / +
页数：2
相关论文
共 50 条
  • [21] Cu Dual- Damascene Interconnects with Direct Chemical Mechanical Polishing Process on Porous Low-k Film
    Izumitani, Junko
    Kodama, Daisuke
    Kido, Shigenori
    Chibahara, Hiroyuki
    Oka, Yoshihiro
    Goto, Kinya
    Suzumura, Naohito
    Fujisawa, Masahiko
    Miyatake, Hiroshi
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2010, 49 (05) : 05FC021 - 05FC024
  • [22] Removal characteristics of hillock on SnO2 thin film by chemical mechanical polishing process
    Seo, YJ
    Kim, NH
    Chang, EG
    Park, J
    Choi, GW
    Lee, WS
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2005, 23 (04): : 1133 - 1136
  • [23] Chemical mechanical polishing as a toolbox for thin film magnetic head manufacturing
    H. van Heeren
    T. Bertens
    F. Pronk
    K. Attenborough
    Microsystem Technologies, 2003, 9 : 155 - 158
  • [24] Redox agent enhanced chemical mechanical polishing of thin film diamond
    Mandal, Soumen
    Thomas, Evan L. H.
    Gines, Laia
    Morgan, David
    Green, Joshua
    Brousseau, Emmanuel B.
    Williams, Oliver A.
    CARBON, 2018, 130 : 25 - 30
  • [25] Chemical mechanical polishing as a toolbox for thin film magnetic head manufacturing
    van Heeren, H
    Bertens, T
    Pronk, F
    Attenborough, K
    MICROSYSTEM TECHNOLOGIES, 2003, 9 (03) : 155 - 158
  • [26] Hydrodynamic characteristics of the thin fluid film in chemical-mechanical polishing
    Chen, JM
    Fang, YC
    IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2002, 15 (01) : 39 - 44
  • [27] Effect of mechanical process parameters on chemical mechanical polishing of Al thin films
    Cho, W
    Ahn, Y
    Baek, CW
    Kim, YK
    MICROELECTRONIC ENGINEERING, 2003, 65 (1-2) : 13 - 23
  • [28] Influence of process parameters on polishing rate of copper in chemical mechanical polishing
    Institute of Microelectronics, Hebei University of Technology, Tianjin 300130, China
    Run Hua Yu Mi Feng, 2006, 7 (113-114+119):
  • [29] Improvement of the surface roughness and sensing properties of cerium dioxide thin film by chemical mechanical polishing
    Kim, Nam-Hoon
    Ko, Pil-Ju
    Lee, Woo-Sun
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2008, 26 (04): : 794 - 797
  • [30] Pretreatment of copper damascene wastewater from chemical and mechanical polishing.
    Smith, EH
    Daniels, M
    Bayan, M
    ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 1999, 218 : U700 - U701
12345