Analysis of phosphorus flame retardant induced leakage currents in IC packages using SQUID microscopy

被引：4

作者：

Deng, Yuliang ^{[1
]}

Pecht, Michael ^{[1
]}

Rogers, Keith ^{[1
]}

机构：

[1] Univ Maryland, Dept Mech Engn, CALCE Elect Prod & Syst Ctr, College Pk, MD 20742 USA

来源：

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 2006年 / 29卷 / 04期

关键词：

flame retardant; green mold compound; red phosphorus; superconducting quantum interference device (SQUID);

D O I：

10.1109/TCAPT.2006.885960

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A superconducting quantum interference device (SQUID) was used to assess leakage currents between adjacent leads of an encapsulated semiconductor device. An electrically conductive path was observed in the package interior. Red phosphorus, used as flame retardant in the mold compound, was identified as the cause of the leakage current path. This paper discusses the principle of SQUID, how it was used to verify and locate the sites of the failure, and the root cause of this new leakage current failure mechanism.

引用

页码：804 / 808

页数：5

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