Thermal-induced interfacial cracking of magnetoelectroelastic material

被引:62
作者
Gao, CF [1 ]
Noda, N [1 ]
机构
[1] Shizuoka Univ, Dept Engn Mech, Shizuoka 4328561, Japan
基金
日本学术振兴会;
关键词
magnetoelectroelastic solid; interface crack; thermal loading; stress intensity factor;
D O I
10.1016/j.ijengsci.2004.03.005
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this paper, we present an explicitly analytic solution for a generalized two-dimensional problem of an interface crack between two dissimilar magnetoelectroelastic materials under uniform heat flow. The crack is assumed to be electrically permeable and thus the thermal-induced electric-magnetic fields within the crack need to be determined as part of the solution. According to the extended Stroh formalism, the thermal potential functions and the electric-magnetic-elastic potential functions are at first presented in concise form. Then, the thermal-induced electric-magnetic fields within the crack and the stress intensity factor at the crack tip are obtained, respectively, in closed form. It is shown that when uniform heat flow is applied at infinity, the thermal-induced electric-magnetic fields within the crack are very complicated, especially near the crack tip for general cases. In addition, the stress fields at the crack tip may be singular and oscillatory, but the structure of singularities is the same as that in a purely elastic bi-material system with interface cracks, that is, it is uniquely characterized by an inverse square root singularity and a pair of oscillatory singularities. (C) 2004 Elsevier Ltd. All rights reserved.
引用
收藏
页码:1347 / 1360
页数:14
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