Adhesion measurements using telephone cord buckles

被引:84
作者
Cordill, M. J. [1 ]
Bahr, D. F.
Moody, N. R.
Gerberich, W. W.
机构
[1] Univ Minnesota, Minneapolis, MN 55455 USA
[2] Washington State Univ, Pullman, WA 99163 USA
[3] Sandia Natl Labs, Livermore, CA 94550 USA
来源
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2007年 / 443卷 / 1-2期
基金
美国国家科学基金会;
关键词
thin films; adhesion; interfaces; buckles; blisters;
D O I
10.1016/j.msea.2006.08.027
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Thin film adhesion energies can be calculated using buckles with the telephone cord geometry. The buckles can be measured through the point of inflection of the buckle or through the center of the buckle and modeled as a straight buckle of uniform width and height. In the tungsten-silica system, a unique delamination morphology involved a transition from the straight to telephone cord buckle. This structure was used to compare various measurement techniques. The stability range between the straight and telephone cord morphology has been shown to be broader than previously described and exhibits a smooth transition from the straight to telephone cord structure. Measurements of the straight-sided buckles produce adhesion energies which are within 15% of the values calculated when approximating the telephone cord as a straight-sided structure at the inflection point of the buckle. (c) 2006 Elsevier B.V. All rights reserved.
引用
收藏
页码:150 / 155
页数:6
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