Thermal boundary resistance predictions from molecular dynamics simulations and theoretical calculations

被引:298
作者
Landry, E. S. [1 ]
McGaughey, A. J. H. [1 ]
机构
[1] Carnegie Mellon Univ, Dept Mech Engn, Pittsburgh, PA 15213 USA
关键词
KAPITZA CONDUCTANCE; PHONON TRANSPORT; THERMOELECTRIC-MATERIALS; SI/GE SUPERLATTICES; LOW TEMPERATURES; CONDUCTIVITY; INTERFACES; HEAT; SILICON; SCATTERING;
D O I
10.1103/PhysRevB.80.165304
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The accuracies of two theoretical expressions for thermal boundary resistance are assessed by comparing their predictions to independent predictions from molecular dynamics (MD) simulations. In one expression (R-E), the phonon distributions are assumed to follow the equilibrium, Bose-Einstein distribution, while in the other expression (R-NE), the phonons are assumed to have nonequilibrium, but bulk-like distributions. The phonon properties are obtained using lattice dynamics-based methods, which assume that the phonon interface scattering is specular and elastic. We consider (i) a symmetrically strained Si/Ge interface, and (ii) a series of interfaces between Si and "heavy-Si," which differs from Si only in mass. All of the interfaces are perfect, justifying the assumption of specular scattering. The MD-predicted Si/Ge thermal boundary resistance is temperature independent and equal to 3.1 X 10(-9) m(2)-K/W below a temperature of similar to 500 K, indicating that the phonon scattering is elastic, as required for the validity of the theoretical calculations. At higher-temperatures, the MD-predicted Si/Ge thermal boundary resistance decreases with increasing temperature, a trend we attribute to inelastic scattering. For the Si/Ge interface and the Si/heavy-Si interfaces with mass ratios greater than two, R-E is in good agreement with the corresponding MD-predicted values at temperatures where the interface scattering is elastic. When applied to a system containing no interface, R-E is erroneously nonzero due to the assumption of equilibrium phonon distributions on either side of the interface. While R-NE is zero for a system containing no interface, it is 40%-60% less than the corresponding MD-predicted values for the Si/Ge interface and the Si/heavy-Si interfaces at temperatures where the interface scattering is elastic. This inaccuracy is attributed to the assumption of bulk-like phonon distributions on either side of the interface.
引用
收藏
页数:11
相关论文
共 62 条
[1]  
Aschcroft N., 1976, Solid State Physics
[2]   Comparison of theoretical and simulation-based predictions of grain-boundary Kapitza conductance in silicon [J].
Aubry, Sylvie ;
Kimmer, Christopher J. ;
Skye, Ashton ;
Schelling, Patrick K. .
PHYSICAL REVIEW B, 2008, 78 (06)
[3]   Role of interface disorder on thermal boundary conductance using a virtual crystal approach [J].
Beechem, Thomas ;
Graham, Samuel ;
Hopkins, Patrick ;
Norris, Pamela .
APPLIED PHYSICS LETTERS, 2007, 90 (05)
[4]   Thermal conductivity of symmetrically strained Si/Ge superlattices [J].
Borca-Tasciuc, T ;
Liu, WL ;
Liu, JL ;
Zeng, TF ;
Song, DW ;
Moore, CD ;
Chen, G ;
Wang, KL ;
Goorsky, MS ;
Radetic, T ;
Gronsky, R ;
Koga, T ;
Dresselhaus, MS .
SUPERLATTICES AND MICROSTRUCTURES, 2000, 28 (03) :199-206
[5]   MODEL FOR LATTICE THERMAL CONDUCTIVITY AT LOW TEMPERATURES [J].
CALLAWAY, J .
PHYSICAL REVIEW, 1959, 113 (04) :1046-1051
[6]   Recent developments in thermoelectric materials [J].
Chen, G ;
Dresselhaus, MS ;
Dresselhaus, G ;
Fleurial, JP ;
Caillat, T .
INTERNATIONAL MATERIALS REVIEWS, 2003, 48 (01) :45-66
[7]   Diffusion-transmission interface condition for electron and phonon transport [J].
Chen, G .
APPLIED PHYSICS LETTERS, 2003, 82 (06) :991-993
[8]   Thermal conductivity and ballistic-phonon transport in the cross-plane direction of superlattices [J].
Chen, G .
PHYSICAL REVIEW B, 1998, 57 (23) :14958-14973
[9]   Minimum superlattice thermal conductivity from molecular dynamics [J].
Chen, YF ;
Li, DY ;
Lukes, JR ;
Ni, ZH ;
Chen, MH .
PHYSICAL REVIEW B, 2005, 72 (17)
[10]   Thermal boundary resistance at an epitaxially perfect interface of thin films [J].
Choi, SH ;
Maruyama, S .
INTERNATIONAL JOURNAL OF THERMAL SCIENCES, 2005, 44 (06) :547-558