STRUCTURAL, SURFACE AND TRANSPORT PROPERTIES OF Sn-Ag ALLOYS

被引:2
作者
Tezel, F. Meydaneri [1 ]
Saatci, B. [2 ]
Ari, M. [2 ]
Acer, S. Durmus [3 ]
Altuner, E. [2 ]
机构
[1] Karabuk Univ, Fac Engn, Dept Met & Mat Engn, TR-78050 Karabuk, Turkey
[2] Erciyes Univ, Dept Phys, TR-38039 Kayseri, Turkey
[3] Dumlupinar Univ, Simav Fac Technol, Dept Energy Syst Engn, TR-43500 Kutahya, Turkey
关键词
Electrical resistivity; radial heat flow; surface properties; grain size; FREE SOLDER ALLOYS; LEAD-FREE SOLDERS; MECHANICAL-PROPERTIES; THERMAL-CONDUCTIVITY; COOLING RATE; PART II; MICROSTRUCTURE; LIQUID; ZN; CU;
D O I
10.1142/S0218625X17500330
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
The structural, surface and transport properties of Sn-Ag alloys were investigated by X-ray diffraction (XRD), radial heat flow, energy-dispersive X-ray (EDX) analysis, scanning electron microscopy (SEM) and four-point probe techniques. We observed that the samples had tetragonal crystal symmetry except for the pure Ag sample which had cubic crystal symmetry, and with the addition of Ag the cell parameters increased slightly. Smooth surfaces with a clear grain boundary for the samples were shown on the SEM micrographs. The grain sizes of pure Ag, beta-Sn and the formed Ag3Sn intermetallic compound phase for Sn-x wt.% Ag [x=1.5, 3.5] binary alloys were determined to be 316nm, between 92 nm and 80 nm and between 36 nm and 34 nm, respectively. The values of electrical resistivity for pure Sn, pure Ag and Sn-x wt.% Ag [x=1.5, 3.5] were obtained to be 22.60x10(-8), 62.36x10(-8), 23.54x10(-8), 24.62x10(-8) Omega.m at the temperature range of 300-450K, respectively. Thermal conductivity values of pure Sn and Sn-x wt.% Ag [x=1.5, 3.5] binary alloys were found to be 60.60 +/- 3.75, 69.00 +/- 4.27 and 84.60 +/- 5.24 W/Km. These values slightly decreased with increasing temperature and increase with increasing of the Ag composition. Additionally, the temperature coefficients of thermal conductivity and electrical resistivity and the Lorenz numbers were calculated.
引用
收藏
页数:13
相关论文
共 51 条
  • [11] Dependence of electrical and thermal conductivity on temperature in directionally solidified Sn-3.5 wt% Ag eutectic alloy
    Cadirli, E.
    Sahin, M.
    Kayali, R.
    Ari, M.
    Durmus, S.
    [J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2011, 22 (11) : 1709 - 1714
  • [12] Chen Z. H, 2003, THESIS
  • [13] Effect of heat treatment on the electrical resistivity of near-eutectic Sn-Ag-CuPb-free solder alloys
    Cook, BA
    Anderson, IE
    Harringa, JL
    Terpstra, RL
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2002, 31 (11) : 1190 - 1194
  • [14] THE MEASUREMENT OF SOLID-LIQUID SURFACE ENERGIES IN THE AL-CU, AL-SI AND PB-SN SYSTEMS
    GUNDUZ, M
    HUNT, JD
    [J]. ACTA METALLURGICA, 1985, 33 (09): : 1651 - 1672
  • [15] SOLID-LIQUID SURFACE-ENERGY IN THE AL-MG SYSTEM
    GUNDUZ, M
    HUNT, JD
    [J]. ACTA METALLURGICA, 1989, 37 (07): : 1839 - 1845
  • [16] Processing and aging characteristics of eutectic Sn-3.5Ag solder reinforced with mechanically incorporated Ni particles
    Guo, F
    Lee, J
    Choi, S
    Lucas, JP
    Bieler, TR
    Subramanian, KN
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2001, 30 (09) : 1073 - 1082
  • [17] Microstructural characterisation of reflowed and isothermally-aged Cu and Ag particulate reinforced Sn-3.5Ag composite solders
    Guo, F
    Choi, S
    Lucas, JP
    Subramanian, KN
    [J]. SOLDERING & SURFACE MOUNT TECHNOLOGY, 2001, 13 (01) : 7 - 18
  • [18] Physical Properties of Sn96.5Ag3.5-Based Solders with Additions of Bi, Ge, and In
    Kaban, I.
    Khalouk, K.
    Koehler, M.
    Hoyer, W.
    Gasser, J. -G.
    [J]. JOURNAL OF ELECTRONIC MATERIALS, 2010, 39 (01) : 70 - 76
  • [19] Effect of zinc additions on structure and properties of Sn-Ag eutectic lead-free solder alloy
    Kamal, Mustafa
    Gouda, El Said
    [J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2008, 19 (01) : 81 - 84
  • [20] Pb-free solder alloys for flip chip applications
    Kang, SK
    Horkans, J
    Andricacos, PC
    Carruthers, RA
    Cotte, J
    Datta, M
    Gruber, P
    Harper, JME
    Kwietniak, K
    Sambucetti, C
    Shi, L
    Brouillette, G
    Danovitch, D
    [J]. 49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, : 283 - 288