Optimum structures for gamma-ray radiation resistant SiC-MOSFETs

被引:15
作者
Mitomo, Satoshi [1 ,2 ]
Matsuda, Takuma [1 ,2 ]
Murata, Koichi [1 ,2 ]
Yokoseki, Takashi [1 ,2 ]
Makino, Takahiro [2 ]
Takeyama, Akinori [2 ]
Onoda, Shinobu [2 ]
Ohshima, Takeshi [2 ]
Okubo, Shuichi [3 ]
Tanaka, Yuki [3 ]
Kandori, Mikio [3 ]
Yoshie, Toru [3 ]
Hijikata, Yasuto [1 ]
机构
[1] Saitama Univ, Sakura Ku, Saitama 3388570, Japan
[2] Natl Inst Quantum & Radiol Sci & Technol QST, Takasaki, Gunma 3701292, Japan
[3] Sanken Elect Co Ltd, Saitama 3528666, Japan
来源
PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE | 2017年 / 214卷 / 04期
关键词
device design; gamma radiation; MOSFET; radiation resistance; SiC; CHANNEL 6H-SIC MOSFETS; INTERFACE TRAPS; CHARGE; IRRADIATION; HARDNESS; DIODES;
D O I
10.1002/pssa.201600425
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In order to develop highly radiation-tolerant SiC MOSFETs, we investigated the dependence of the gamma-ray radiation response on the gate oxide thickness and nitridation processes, used for oxide growth oxide (60 nm) showed a rapid decrease in the threshold voltage shift Delta V-th of more than 400 kGy, and transitioned to the normally-on state at lower doses than those with a thin gate oxide (35 nm). The MOSFETs with gate oxides treated with lower concentrations of N2O (10%) demonstrated a higher radiation tolerance (Delta V-th, channel mobility, and subthreshold swing) than with a 100% N2O treatment. The MOSFETs with more p-well implantation steps (three steps) showed a smaller negative shift of the threshold voltage relative to those implanted with two steps. (C) 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
引用
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页数:7
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