Chip-to-chip inductive wireless power transmission system for SiP applications

被引：24

作者：

Onizuka, Kohei ^{[1
]}

Kawaguchi, Hiroshi ^{[3
]}

Takamiya, Makoto ^{[1
]}

Kuroda, Tadahiro ^{[4
]}

Sakurai, Takayasu ^{[2
]}

机构：

[1] Univ Tokyo, Inst Ind Sci, Tokyo 106, Japan

[2] Univ Tokyo, Ctr Collaborat Res, Tokyo 106, Japan

[3] Kobe Univ, Dept Comp & Syst Engn, Kobe, Hyogo, Japan

[4] Keio Univ, Dept Elect & Elect Engn, Yokohama, Kanagawa, Japan

来源：

PROCEEDINGS OF THE IEEE 2006 CUSTOM INTEGRATED CIRCUITS CONFERENCE | 2006年

基金：

日本学术振兴会;

关键词：

D O I：

10.1109/CICC.2006.320994

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A chip-to-chip inductive wireless power transmission system is proposed and the feasibility is experimentally demonstrated for the first time. The circuit realized 2.5mW power transmission at the output DC voltage of 0.5V using 700x700 mu m on-chip planar inductors for the transmitter and the receiver. Methods to optimize the circuit design about the maximum transmission power and the simulated optimization results are discussed.

引用

页码：575 / 578

页数：4

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