Explanation for the AC-DC voltage transfer differences in thin-film multijunction thermal converters on silicon chips at high frequencies

被引:8
作者
Scarioni, Luciana [1 ]
Klonz, Manfred
Kessler, Ernst
机构
[1] Univ Carabobo, Fac Ciencias & Tecnol, Dept Fis, Valencia 2010, Venezuela
[2] Inst Phys HochTechnol EV, D-07745 Jena, Germany
关键词
AC-DC voltage transfer; bond pads; high frequency; silicon chip;
D O I
10.1109/TIM.2007.890798
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, an explanation for the ac-dc voltage transfer differences at frequencies greater than 100 kHz of the standard thin-film or planar multijunction thermal converter (PMJTC) developed at the Physikalisch-Technische Bundesanstalt and fabricated on a silicon chip has been found. The simulation indicates that the capacitance of the bond pads of the heater is the reason for an increase of the ac-dc voltage transfer difference of PMJTCs with higher heater resistance to negative values. Bond pads of smaller size and larger distance are shown to improve the frequency response.
引用
收藏
页码:567 / 570
页数:4
相关论文
共 8 条
[1]  
KINARD JR, 1994, Patent No. 5287081
[2]   INCREASING THE TIME CONSTANT OF A THIN-FILM MULTIJUNCTION THERMAL CONVERTER FOR LOW-FREQUENCY APPLICATION [J].
KLONZ, M ;
WEIMANN, T .
IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 1991, 40 (02) :350-351
[3]   ACCURATE THIN-FILM MULTIJUNCTION THERMAL CONVERTER ON A SILICON CHIP [J].
KLONZ, M ;
WEIMANN, T .
IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 1989, 38 (02) :335-337
[4]  
Kohlrausch F, 1996, PRAKTISCHE PHYS, V3
[5]   High-frequency thin-film multijunction thermal converter on a quartz crystal chip [J].
Scarioni, L ;
Klonz, M ;
Janik, D ;
Laiz, H ;
Kampik, M .
IEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT, 2003, 52 (02) :345-349
[6]  
WADELL BC, 1991, DESIGN HDB
[7]  
WUNSCH T, 2000, P CPEM C MAY, P387
[8]  
WUNSCH T, 2001, THESIS U NEW MEXICO