Spray etching 2 μm features in 304 stainless steel

被引:8
作者
Chatterjee, Sudipta
Ujihara, Motoki
Lee, Dong Gun
Chen, Jerry
Lei, Stanley
Carman, Greg P.
机构
[1] Univ Calif Los Angeles, Los Angeles, CA 90095 USA
[2] Kemac Technol Inc, Azusa, CA 91702 USA
关键词
D O I
10.1088/0960-1317/16/12/010
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
304 stainless steel samples were patterned with either a photoresist (PR) mask or a silicon nitride (Si3Ni4) mask and then subjected to either wet immersion etching or spray etching techniques with ferric chloride (FeCl3). The silicon nitride mask provides much better adhesion to the stainless steel substrate resulting in less undercut compared to the PR mask. When a silicon nitride mask was subjected to spray etching, better adhesion and less undercut enabled features as small as 1.8 mu m with an etch depth of 5.6 mu m. This is an order of magnitude smaller than current spray etching techniques (20-50 mu m) used in the steel industry. This procedure will allow spray etching features for batch fabrication for a variety of metals including steels, aluminum, nickel-based alloys and copper-based alloys with microscale resolution.
引用
收藏
页码:2585 / 2592
页数:8
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