共 50 条
- [32] Modeling of Electromigration of the Through Silicon Via Interconnects 2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP), 2010, : 1221 - 1225
- [33] Silicon-based building blocks for VLSI on-chip optical interconnects PROCEEDINGS OF THE IEEE 2005 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, 2005, : 237 - 239
- [34] Wavelets modeling of inductance of interconnects in digital circuits of mixed-signal ICs 2005 ASIA-PACIFIC MICROWAVE CONFERENCE PROCEEDINGS, VOLS 1-5, 2005, : 1279 - 1283
- [37] Using Multiple Scales Method to calculate threshold crossing time for the ramp response for high inductance VLSI interconnects 2008 IEEE WORKSHOP ON SIGNAL PROPAGATION ON INTERCONNECTS, 2008, : 192 - 195
- [38] A minimum-order boundary element method to extract the 3-D inductance and resistance of the interconnects in VLSI SCIENCE IN CHINA SERIES F-INFORMATION SCIENCES, 2002, 45 (06): : 453 - 461
- [39] A minimum-order boundary element method to extract the 3-D inductance and resistance of the interconnects in VLSI Science in China Series F: Information Sciences, 2002, 45 (6): : 453 - 461
- [40] New analytic expressions for mutual inductance and resistance of coupled interconnects on lossy silicon substrate 2001 TOPICAL MEETING ON SILICON MONOLITHIC INTEGRATED CIRCUITS IN RF SYSTEMS, DIGEST OF PAPERS, 2001, : 192 - 200