Approximate analytical modeling of silicon internal inductance of VLSI interconnects

被引:0
|
作者
Ymeri, H
Nauwelaersa, B
Maex, K
De Roest, D
Stucchi, M
机构
[1] Katholieke Univ Leuven, Dept Elect Engn, Div ESAT TELEMIC, ESAT, B-3001 Louvain, Belgium
[2] IMEC, B-3001 Louvain, Belgium
关键词
semiconductors; microelectronics; IC; Integrated Circuits; VLSI circuits; Very Large Scale of Integration circuits; interconnects; internal inductance; lossy silicon substrates; analytical modeling; approximate modeling; GREEN'S unctions; electric current; current distribution; eddy current; substrate resistivity;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In previous work, a closed form expressions for the series line impedance per unit length of a single and multiple coupled interconnects on lossy silicon substrate were presented. In this paper, the induced current density distribution inside silicon substrate and quasi-static Green's function approach were used to derive the frequency-dependent closed-form expression for the internal inductance per unit length accociated with the silicon substrate. With this expression, we can quantitatively determine what percentage of the total inductance per unit length is associated with the internal silicon substrate inductance for a given frequency. The effect of the substrate resistivity on the inductance of on-chip interconnects was examined. It was shown that depending on the frequency, large changes in the inductance can occur due to this effect.
引用
收藏
页码:79 / 81
页数:3
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