Three-dimensional asymptotic stress field at the front of an unsymmetric bimaterial pie-shaped wedge under antiplane shear loading

被引:24
作者
Chiu, JSH [1 ]
Chaudhuri, RA [1 ]
机构
[1] Univ Utah, Dept Mat Sci & Engn, Salt Lake City, UT 84112 USA
关键词
three-dimensional; stress singularity; bimaterial; unsymmetric; wedge; antiplane shear;
D O I
10.1016/S0263-8223(02)00030-2
中图分类号
O3 [力学];
学科分类号
08 ; 0801 ;
摘要
Three-dimensional asymptotic stress field in the vicinity of the front of a bimaterial pie-shaped wedge of general (unsymmetric) geometry is obtained by a recently developed eigenfunction expansion method. The bimaterial pie-shaped wedge is subjected to four combinations of wedge-side boundary conditions - free-free, clamped-clamped, free-clamped and clamped-free. Each material is isotropic and elastic, but with different material properties. Additionally, numerical results pertaining to the variation of the lowest eigenvalues (or stress singularities) with respect to the wedge opening angle of the bimaterial wedge, subjected to the aforementioned wedge-side boundary conditions, are also presented. Dependence of the same on the material properties of the component material phases is also an important part of the present investigation. (C) 2002 Published by Elsevier Science Ltd.
引用
收藏
页码:129 / 137
页数:9
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