Improved light extraction of nitride-based flip-chip light-emitting diodes via sapphire shaping and texturing

被引:45
作者
Huang, Shao-Hua [1 ]
Horng, Ray-Hua
Wen, Kuo-Sheng
Lin, Yi-Feng
Yen, Kuo-Wei
Wuu, Dong-Sing
机构
[1] Natl Chung Hsing Univ, Dept Mat Sci & Engn, Taichung 402, Taiwan
[2] Natl Chung Hsing Univ, Inst Precis Engn, Taichung 40227, Taiwan
关键词
chip shaping; flip-chip; GaN; light-emitting diode (LED); surface texturing;
D O I
10.1109/LPT.2006.886823
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A novel flip-chip structure of GaN-sapphire light-emitting diodes (LEDs) was developed to improve the external quantum efficiency, where the sapphire substrate was textured and shaped with beveled sidewalls using a wet etching technique. The forward voltage of the conventional flip-chip and shaped flip-chip GaN LEDs were 2.84 and 2.85 V at 20 mA, respectively. This indicates that the GaN LED was not destroyed during the sapphire wet etching process. It was found that the output power increased from 9.3 to 14.2 mW, corresponding to about 52% increases in the external quantum efficiency. The results agree well with the simulation data that the shaped flip-chip GaN LED can provide better light extraction efficiency than that of the conventional flip-chip sample.
引用
收藏
页码:2623 / 2625
页数:3
相关论文
共 9 条
[1]   Nitride-based flip-chip ITO LEDs [J].
Chang, SJ ;
Chang, CS ;
Su, YK ;
Lee, CT ;
Chen, WS ;
Shen, CF ;
Hsu, YP ;
Shei, SC ;
Lo, HM .
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2005, 28 (02) :273-277
[2]  
DWIKUSURNA F, 2002, J ELECTROCHEM SOC, V49, pG603
[3]   Increase in the extraction efficiency of GaN-based light-emitting diodes via surface roughening [J].
Fujii, T ;
Gao, Y ;
Sharma, R ;
Hu, EL ;
DenBaars, SP ;
Nakamura, S .
APPLIED PHYSICS LETTERS, 2004, 84 (06) :855-857
[4]   Light-output enhancement in a nitride-based light-emitting diode with 22° undercut sidewalls [J].
Kao, CC ;
Kuo, HC ;
Huang, HW ;
Chu, JT ;
Peng, YC ;
Hsieh, YL ;
Luo, CY ;
Wang, SC ;
Yu, CC ;
Lin, CF .
IEEE PHOTONICS TECHNOLOGY LETTERS, 2005, 17 (01) :19-21
[5]   Vertical electrode GaN-based light-emitting diode fabricated by selective wet etching technique [J].
Kim, SJ .
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2005, 44 (5A) :2921-2924
[6]   High-power truncated-inverted-pyramid (AlxGa1-x)0.5In0.5P/GaP light-emitting diodes exhibiting >50% external quantum efficiency [J].
Krames, MR ;
Ochiai-Holcomb, M ;
Höfler, GE ;
Carter-Coman, C ;
Chen, EI ;
Tan, IH ;
Grillot, P ;
Gardner, NF ;
Chui, HC ;
Huang, JW ;
Stockman, SA ;
Kish, FA ;
Craford, MG ;
Tan, TS ;
Kocot, CP ;
Hueschen, M ;
Posselt, J ;
Loh, B ;
Sasser, G ;
Collins, D .
APPLIED PHYSICS LETTERS, 1999, 75 (16) :2365-2367
[7]   Low resistance and reflective Mg-doped indium oxide-Ag ohmic contacts for flip-chip light-emitting diodes [J].
Song, J ;
Leem, DS ;
Kwak, JS ;
Nam, OH ;
Park, Y ;
Seong, TY .
IEEE PHOTONICS TECHNOLOGY LETTERS, 2004, 16 (06) :1450-1452
[8]   Impact of texture-enhanced transmission on high-efficiency surface-textured light-emitting diodes [J].
Windisch, R ;
Rooman, C ;
Meinlschmidt, S ;
Kiesel, P ;
Zipperer, D ;
Döhler, GH ;
Dutta, B ;
Kuijk, M ;
Borghs, G ;
Heremans, P .
APPLIED PHYSICS LETTERS, 2001, 79 (15) :2315-2317
[9]   Fabrication of pyramidal patterned sapphire substrates for high-efficiency InGaN-based light emitting diodes [J].
Wuu, D. S. ;
Wang, W. K. ;
Wen, K. S. ;
Huang, S. C. ;
Lin, S. H. ;
Horng, R. H. ;
Yu, Y. S. ;
Pan, M. H. .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2006, 153 (08) :G765-G770