The RF impact of coupled component tolerances and gridded ground planes in LTCC technology and their design countermeasures

In this paper we will present in a comprehensive way the major sources of manufacturing tolerances specific to LTCC technology, which influence the RF performance of coupled type components. We suggest previously undocumented in a single source, manufacturing and RF technology design techniques to predict and reduce their impact. Further more we additionally present a new technique which introduces multiple gridded ground planes with specific geometrical properties in order to reduce their RF performance impact and assist in producing predictable LTCC embedded passive circuit designs.