Mechanical properties of Cu-Nb microcomposites fabricated by the bundling and drawing process

被引：28

作者：

Hong, SI

Hill, MA

机构：

[1] Chungnam Natl Univ, Dept Met Engn, Taejon 305764, South Korea

[2] Chungnam Natl Univ, RASOM, Taejon 305764, South Korea

[3] Univ Calif Los Alamos Natl Lab, Div Mat Sci, Los Alamos, NM 87545 USA

来源：

SCRIPTA MATERIALIA | 2000年 / 42卷 / 08期

基金：

美国能源部; 美国国家科学基金会;

关键词：

mechanical properties; microstructure; recrystallization and recovery;

D O I：

10.1016/S1359-6462(99)00423-6

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The microstructural and mechanical stability of Cu-Nb microcomposite wires fabricated by the bundling and drawing process was examined. It was found that the ratio of yield stresses is close to that of Young's moduli. The yield strength of bundled Cu-Nb microcomposite wire was predicted by modifying the model of Spitzig and coworkers.

引用

页码：737 / 742

页数：6

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