Reduced-order modeling of capacitive MEMS microphones using mixed-level simulation

被引:2
作者
Niessner, M. [1 ]
Bedyk, W. [1 ]
Schrag, G. [1 ]
Wachutka, G. [1 ]
Margesin, B. [2 ]
Faes, A. [2 ]
机构
[1] Tech Univ Munich, Inst Phys Electrotechnol, Arcisstr 21, D-80290 Munich, Germany
[2] IRST, Microsyst Div, I-38050 Trento, Italy
来源
ASDAM '06: SIXTH INTERNATIONAL CONFERENCE ON ADVANCED SEMICONDUCTOR DEVICES AND MICROSYSTEMS, CONFERENCE PROCEEDINGS | 2006年
关键词
D O I
10.1109/ASDAM.2006.331209
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We demonstrate a reduced-order modeling methodology based on the mixed-level simulation approach that allows for the rapid evaluation of microphone design variations with arbitrary arrangement and shape of the acoustic holes. The resulting reduced-order models take multiply coupled energy domains into account and are capable of describing the effects caused by non-linear fluidic damping. The methodology is easily approachable, as the generation of the reduced-order models is automated by the use of a MATLAB toolbox.
引用
收藏
页码:283 / 286
页数:4
相关论文
共 8 条
[1]   A SILICON CONDENSER MICROPHONE USING BOND AND ETCH-BACK TECHNOLOGY [J].
BERGQVIST, J ;
RUDOLF, F .
SENSORS AND ACTUATORS A-PHYSICAL, 1994, 45 (02) :115-124
[2]  
FAES A, 2004, P AISEM 04 C
[3]  
HSU PC, 1998, P MEMS 98 C HEID GER
[4]   A SILICON CONDENSER MICROPHONE WITH STRUCTURED BACK PLATE AND SILICON-NITRIDE MEMBRANE [J].
KUHNEL, W ;
HESS, G .
SENSORS AND ACTUATORS A-PHYSICAL, 1992, 30 (03) :251-258
[5]  
MARGESIN B, 2003, P AISEM 03 C
[6]  
Morse PM., 1948, Vibration and Sound
[7]   Physically based modeling of squeeze film damping by mixed-level system simulation [J].
Schrag, G ;
Wachutka, G .
SENSORS AND ACTUATORS A-PHYSICAL, 2002, 97-8 :193-200
[8]  
SKVOR Z, 1967, ACUSTICA, V19, P295