Highly Dependable 3-D Stacked Multicore Processor System Module Fabricated Using Reconfigured Multichip-on-Wafer 3-D Integration Technology

被引：0

作者：

Lee, K-W. ^{[1
,2
]}

Hashimoto, H. ^{[1
]}

Onishi, M. ^{[1
,2
]}

Konno, S. ^{[1
]}

Sato, Y. ^{[1
]}

Nagai, C. ^{[1
]}

Bea, J-C ^{[1
,2
]}

Murugesan, M. ^{[1
,2
]}

Fukushima, T. ^{[1
,2
]}

Tanaka, T. ^{[3
]}

Koyanagi, M. ^{[1
,2
]}

机构：

[1] Tohoku Univ, New Ind Creat Hatchery Ctr NICHe, Sendai, Miyagi 980, Japan

[2] Tohoku Univ, Global INTegrat Initiat GINTI, Sendai, Miyagi 980, Japan

[3] Tohoku Univ, Dept Biomed Engn, Sendai, Miyagi 980, Japan

来源：

2014 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) | 2014年

关键词：

D O I：

暂无

中图分类号：

TP301 [理论、方法];

学科分类号：

081202 ;

摘要：

A highly dependable 3-D stacked multicore processor module composed of 4-layer stacked 3-D multicore processor chip and 2-layer stacked 3-D cache memory chip is implemented using reconfigured multichip-on-wafer 3-D integration and backside TSV technologies for the first time. Tier boundary scan, self-repair circuits, and BIST circuits in the 4-layer stacked 3-D multicore processor chip and the basic read/write functions of memory circuits in the 2-layer stacked 3-D cache memory chip are successfully evaluated. High-density TSVs and micro-joining characteristics in the 3-D stacked chip were evaluated by a non-destructive method using high resolution X-ray CT scanning tool.

引用

页数：4

共 8 条

[1] Fukushima T., 2013, IEEE ECTC, P58
[2] Koyanagi M., S FUT EL DEV, P50
[3] Kunio T., 1989, International Electron Devices Meeting 1989. Technical Digest (Cat. No.89CH2637-7), P837, DOI 10.1109/IEDM.1989.74183
[4] Lee K.W., 2014, IEEE IRPS
[5] Lee K.W., 2012, IEDM, P785, DOI DOI 10.1109/IEDM.2012.6479156
[6] Die-Level 3-D Integration Technology for Rapid Prototyping of High-Performance Multifunctionality Hetero-Integrated Systems
Lee, Kang-Wook
Ohara, Yuki
Kiyoyama, Kouji
Bea, Ji-Cheol
Murugesan, Mariappan
Fukushima, Takafumi
Tanaka, Tetsu
Koyanagi, Mitsumasa
[J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2013, 60 (11) : 3842 - 3848
[7] Three-Dimensional Hybrid Integration Technology of CMOS, MEMS, and Photonics Circuits for Optoelectronic Heterogeneous Integrated Systems
Lee, Kang-Wook
Noriki, Akihiro
Kiyoyama, Kouji
Fukushima, Takafumi
Tanaka, Tetsu
Koyanagi, Mitsumasa
[J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 2011, 58 (03) : 748 - 757
[8] Zhang D., 2013, IEEE EL COMP PACK C, P1407

← 1 →