Test research on wire deflection detection of a diamond wire saw

被引：9

作者：

Wu Qin ^{[1
]}

Liu Zhidong ^{[1
]}

Shen Lida ^{[1
]}

Yue Weidong ^{[1
]}

Zhang Bin ^{[1
]}

机构：

[1] Nanjing Univ Aeronaut & Astronaut, Coll Mech & Elect Engn, Nanjing 210016, Jiangsu, Peoples R China

来源：

INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY | 2017年 / 91卷 / 1-4期

基金：

中国国家自然科学基金;

关键词：

Diamond wire saw; Semiconductor; Special-shaped pieces; Wire deflection control;

D O I：

10.1007/s00170-016-9787-6

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

Wire deflection affects the shape precision of workpiece during the profile cutting process with diamond wire saw. This study proposes a method for solving this problem using wire deflection detection, called light projection method. This method is based on the space position of the diamond wire. This research also analyzes the effects of wire deflection on shape precision, develops a detection and control device that allows feedback control according to the change in wire projection position, judges the wire position change, and uses this device to perform validation tests with polycrystalline silicon materials. The test shows that this detection and controlling device can effectively control the wire deflection phenomenon in the process of diamond wire cutting process. The roundness of a polysilicon with 20 mm thickness and phi 20 mm diameter can be controlled within 0.05 mm, enabling significant improvement in the cutting shape precision and cutting stability.

引用

页码：1347 / 1354

页数：8