Size Refinement of Copper Nanoparticles: A Perspective from Electrochemical Nucleation and Growth Mechanism

被引:24
作者
Yang, Guannan [1 ]
Zeng, Xian [1 ]
Wang, Pengyu [1 ]
Li, Chao [1 ]
Xu, Guangdong [1 ]
Li, Zhen [1 ]
Luo, Jiye [2 ]
Zhang, Yu [1 ]
Cui, Chengqiang [1 ]
机构
[1] Guangdong Univ Technol, State Key Lab Precis Elect Mfg Technol & Equipmen, Sch Electromech Engn, Guangzhou 510006, Peoples R China
[2] Guangdong Univ Technol, Sch Chem Engn & Light Ind, Guangzhou 510006, Peoples R China
基金
中国国家自然科学基金; 国家重点研发计划;
关键词
nanoparticles; electrochemistry; redox chemistry; nucleation mechanism; growth model; CU NANOPARTICLES; METAL NANOPARTICLES; ASCORBIC-ACID; ELECTRODEPOSITION; CARBON; OXIDE; REDUCTION; NANOWIRES; STORAGE; FILMS;
D O I
10.1002/celc.202001534
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
In this paper, isotropic copper nanoparticles (CuNPs) were successfully sythesized by using Cu(CH3COO)(2) and ascorbic acid in absolute ethanol solution. With the addition of polyvinylpyrrolidone (PVP) protective additive, the size distribution range of the synthesized CuNPs was significantly reduced from 650 +/- 415 nm to 51 +/- 12 nm. Electrodeposition analysis revealed that PVP could greatly suppress the reduction of Cu but had no prominent effects on the deposition mechanism. Based on the potentiostatic deposition results, a growth model was proposed to improve the applicability of the Scharifker-Hills model by considering both the surface inhibition effect and the mass diffusion during the growth process of Cu nuclei. The experimental data fitted well with the prediction results from the proposed model, indicating that the electrodeposition of Cu followed the progressive nucleation process. The PVP additive could inhibit the deposition and growth of Cu by increasing the surface inhibition for cation incorporation on the nuclei, which was probably the main reason for the refinement of the sythesized CuNPs. Our findings can provide insights for the preparation of metallic nanoparticles and the understanding of their deposition mechanism.
引用
收藏
页码:819 / 828
页数:10
相关论文
共 73 条
  • [1] [Anonymous], 2002, Student Solutions Manual to accompany Electrochemical Methods: Fundamentals and Applicaitons
  • [2] [Anonymous], 2015, RSC ADV
  • [3] Application of Ni and Cu nanoparticles in transient liquid phase (TLP) bonding of Ti-6Al-4V and Mg-AZ31 alloys
    Atieh, Anas M.
    Khan, Tahir I.
    [J]. JOURNAL OF MATERIALS SCIENCE, 2014, 49 (22) : 7648 - 7658
  • [4] Balasubramanian Sengottuvelan, 2014, J NANOTECHNOLOGY
  • [5] Copper nanoparticles of well-controlled size and shape: a new advance in synthesis and self-organization
    Ben Aissa, Mohamed Ali
    Tremblay, Benoit
    Andrieux-Ledier, Amandine
    Maisonhaute, Emmanuel
    Raouafi, Noureddine
    Courty, Alexa
    [J]. NANOSCALE, 2015, 7 (07) : 3189 - 3195
  • [6] Structural properties of electrodeposited Cu-Ag alloys
    Bernasconi, Roberto
    Hart, James L.
    Lang, Andrew C.
    Magagnin, Luca
    Nobili, Luca
    Taheri, Mitra L.
    [J]. ELECTROCHIMICA ACTA, 2017, 251 : 475 - 481
  • [7] Ligand-Induced Fate of Embryonic Species in the Shape-Controlled Synthesis of Rhodium Nanoparticles
    Biacchi, Adam J.
    Schaak, Raymond E.
    [J]. ACS NANO, 2015, 9 (02) : 1707 - 1720
  • [8] Controlled synthesis of copper nano/microstructures using ascorbic acid in aqueous CTAB solution
    Bicer, Mustafa
    Sisman, Ilkay
    [J]. POWDER TECHNOLOGY, 2010, 198 (02) : 279 - 284
  • [9] Bockris J. O. M., 2000, MODERN ELECTROCHEM A
  • [10] Hybrid films of reduced graphene oxide with noble metal nanoparticles generated at a liquid/liquid interface for applications in catalysis
    Bramhaiah, K.
    John, Neena S.
    [J]. RSC ADVANCES, 2013, 3 (21): : 7765 - 7773