Interfacial Microstructure and Thermal Stability of Zr55Cu30Ni5Al10 Metallic Glass Joints Formed by Ultrasonic Bonding

被引：9

作者：

Maeda, Masakatsu ^{[1
]}

Yamasaki, Takao ^{[1
]}

Takahashi, Yasuo ^{[1
]}

Inoue, Akihisa ^{[2
]}

机构：

[1] Osaka Univ, Ctr Adv Sci & Innovat, Suita, Osaka 5650871, Japan

[2] Tohoku Univ, Sendai, Miyagi 9808577, Japan

来源：

MATERIALS TRANSACTIONS | 2009年 / 50卷 / 06期

关键词：

ultrasonic bonding; zirconium-based metallic glass; structure of joint interface; thermal stability of amorphous state; continuous-heating transformation diagram; thermal history; BULK AMORPHOUS-ALLOYS; SUPERCOOLED LIQUID; STRENGTH; BEHAVIOR; PHASE; WIRE; WELD; MPA;

D O I：

10.2320/matertrans.ME200825

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The interfacial microstructure and thermal stability of Zr55Cu30Ni5Al10 metallic glass joints formed by ultrasonic bonding were investigated. The analysis of interfacial microstructure by scanning electron microscopy and transmission electron microscopy has proven the successful formation of a considerably broad adhered area free of devitrification by ultrasonic bonding without external heating. The thermal analysis of the as-prepared Zr55Cu30Ni5Al10 metallic glass by differential scanning calorimetry has revealed the change in the devitrification temperature of Zr55Cu30Ni5Al10 metallic glass depending on the heating rate. The direct measurement of the temperature at the interface during ultrasonic bonding has clarified the thermal history at the interface. The temperature exceeds barely the glass-transition temperature (T-g) and the total time exceeding T-g is very short. It is also suggested that the temperature starts to decrease while the ultrasonic vibration is being applied clue to the suppression of frictional sliding by adhesion. As a result, the thermal stability of the metallic glass is not deteriorated by ultrasonic bonding. [doi:10.2320/matertrans.ME200825]

引用

页码：1263 / 1268

页数：6

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