Effect of substrate surfaces and heat treatments on adhesion of Cu films

被引：11
作者：
Choi, GJ
Cho, YS
机构：
[1] Division of Chemical Engineering, Korea Inst. of Sci. and Technology, Cheongryang, Seoul 130-650
来源：
MATERIALS LETTERS | 1997年 / 32卷 / 2-3期
关键词：
substrate surfaces; heat treatments; adhesion; Cu films;
D O I：
10.1016/S0167-577X(97)00024-4
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The adhesion characteristics of Cu films grown on Si and TiN substrates by PECVD were studied. Cu(etac)(2) was used as metalorganic precursor. The adhesion strength of Cu films was measured by the peel test in accordance with ASTM B 571-91. The adhesion strength of Cu films before 450 degrees C treatment was 13-27 kg(f)/cm. The oxidation of substrates before deposition showed a negative effect on the adhesion of Cu films. The adhesion was substantially improved by thermal treatment at 450 degrees C. The adhesion improvement by 450 degrees C treatment was mainly attributed to the removal of tensile residual stress in Cu films.
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收藏
页码：185 / 189
页数：5
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