How to achieve artefact-free FIB milling on polyimide packages

被引:0
|
作者
Hrncir, Tomas [1 ]
Sikula, Marek [1 ]
obona, Jozef Vincenc [1 ]
Gounet, Pascal [2 ]
机构
[1] TESCAN Brno Sro, Brno, Czech Republic
[2] STMicroelectronics, Grenoble, France
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中图分类号
T [工业技术];
学科分类号
08 ;
摘要
High speed FIB cross-sectioning of polyimide material was traditionally very difficult because of artifacts created by FIB on the cross section plane. Therefore we propose a simple method, which retains the high speed of the FIB process, but significantly improves the quality of the cross section plane. The method involves a hard mask positioned close to the intended place of the cross section using a precise manipulator. This then enables highly accurate and site-specific FIB cross sectioning. Cross sections can be made very quickly and with the excellent quality in comparison to standard procedures based on gas-assisted deposition of a protection layer.
引用
收藏
页码:630 / 634
页数:5
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