Performance of self-healing epoxy with microencapsulated healing agent and shape memory alloy wires

被引：141

作者：

Kirkby, E. L. ^{[1
]}

Michaud, V. J. ^{[1
]}

Manson, J. -A. E. ^{[1
]}

Sottos, N. R. ^{[2
]}

White, S. R. ^{[2
]}

机构：

[1] Ecole Polytech Fed Lausanne, Inst Mat, Lab Technol Composites & Polymeres, CH-1015 Lausanne, Switzerland

[2] Univ Illinois, Auton Mat Syst Grp, Beckman Inst Adv Sci & Technol, Urbana, IL 61801 USA

来源：

POLYMER | 2009年 / 50卷 / 23期

基金：

瑞士国家科学基金会;

关键词：

Self-healing polymer; Microcapsule; Shape memory alloy wire; HOLLOW GLASS-FIBERS; COMPOSITE; POLYMERS; CATALYST;

D O I：

10.1016/j.polymer.2009.05.014

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

We report the first measurements of a self-healing polymer that combines a microencapsulated liquid healing agent and shape memory alloy (SMA) wires. When a propagating crack ruptures the embedded microcapsules, the liquid healing agent is automatically released into the crack where it contacts a solid catalyst embedded in the matrix. The SMA wires are then activated to close the crack during the healing period. We show that dramatically improved healing performance is obtained by the activation of embedded SMA wires. We conclude that improved healing is due to a reduction of crack volume as a result of pulling the crack faces closed, and more complete polymerization of the healing agent due to the heat produced by the activated SMA wires. (C) 2009 Elsevier Ltd. All rights reserved.

引用

页码：5533 / 5538

页数：6

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