The characterization of thermal and elastic constants for an epoxy photoresist SU8 coating

被引:88
作者
Feng, R [1 ]
Farris, RJ [1 ]
机构
[1] Univ Massachusetts, Dept Polymer Sci & Engn, Amherst, MA 01003 USA
关键词
Aspect ratio - Differential scanning calorimetry - Elastic moduli - Epoxy resins - Holography - Mechanical variables measurement - Photoresists - Poisson ratio - Tensile testing - Thermal expansion - Thermogravimetric analysis;
D O I
10.1023/A:1020862129948
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
All of the thermal and elastic constants of the high-aspect ratio, negative, UV resist, SU8 coating were carried out, and the compliance matrix of the coating was obtained. DSC, TGA, TMA, and DMTA techniques were utilized to study the thermal properties of the material. The in-plane thermal expansion coefficient (TEC) (alpha(1)) was determined by TMA, and the glass transition behavior was studied by DMTA. The TGA study provided information about the thermal stability of the material, and DSC was applied to study the thermal calorimetric properties of the material. The in-plane Young's modulus (E-1) was measured by tensile tests. The residual stresses of a 1D stretched ribbon sample and a 2D stretched membrane sample were measured by vibrational holography tests, and the in-plane Poisson's ratio (nu(1)) was also determined by holography. The out-of-plane Poisson's ratio (nu(2)) was obtained by high pressure gas dilatometry measurements. The bulk compressibility (kappa) and the volumetric TEC (alpha(v)) of the material were measured by a pressure-volume-temperature (PVT) apparatus. Finally, the out-of-plane properties, including the out-of-plane TEC (alpha(2)) and the out-of-plane Young's modulus (E-2), were calculated from the measured in-plane properties and the volumetric properties. Therefore, the compliance matrix of the studied SU8 coating could be obtained. (C) 2002 Kluwer Academic Publishers.
引用
收藏
页码:4793 / 4799
页数:7
相关论文
共 18 条
  • [1] Combining microstereolithography and thick resist UV lithography for 3D microfabrication
    Bertsch, A
    Lorenz, H
    Renaud, P
    [J]. MICRO ELECTRO MECHANICAL SYSTEMS - IEEE ELEVENTH ANNUAL INTERNATIONAL WORKSHOP PROCEEDINGS, 1998, : 18 - 23
  • [2] CHEN MJ, 1998, THESIS U MASSACHUSET
  • [3] Orthotropic elastic constants for polyimide film
    Cho, SH
    Kim, G
    McCarthy, TJ
    Farris, RJ
    [J]. POLYMER ENGINEERING AND SCIENCE, 2001, 41 (02) : 301 - 307
  • [4] High-aspect-ratio, ultrathick, negative-tone near-UV photoresist for MEMS applications
    Despont, M
    Lorenz, H
    Fahrni, N
    Brugger, J
    Renaud, P
    Vettiger, P
    [J]. MEMS 97, PROCEEDINGS - IEEE THE TENTH ANNUAL INTERNATIONAL WORKSHOP ON MICRO ELECTRO MECHANICAL SYSTEMS: AN INVESTIGATION OF MICRO STRUCTURES, SENSORS, ACTUATORS, MACHINES AND ROBOTS, 1997, : 518 - 522
  • [5] EYRE B, 1995, 11 IEEE MICR EL MECH, P218
  • [6] FARRIS RJ, 1964, J APPL POLYM SCI, V8, P25
  • [7] FENG R, 2002, IN PRESS J APPL POLY
  • [8] FENG R, 2002, UNPUB J MICROMECH MI
  • [9] LABIANCA N, 1993, ELEC SOC P V, V9518, P386
  • [10] LAI WM, 1996, INTRO CONTINUUM MECH