Interfacial Reactions between Lead-free solders and Cu-40Zn Alloys

被引：0

作者：

Yen, Yee-Wen ^{[1
]}

Chen, Pei-Yu ^{[1
]}

Chen, Guan-Da ^{[1
]}

机构：

[1] Natl Taiwan Univ Sci & Technol, Dept Mat Sci & Engn, Taipei 106, Taiwan

来源：

2017 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP) | 2017年

关键词：

interfacial reaction; lead-free solders; Cu-xZn alloy; ternary Sn-Zn-Cu phase; PB-FREE SOLDERS; SN;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The interfacial reactions in Sn, Sn-3.0Ag-0.5Cu (SAC, in wt%) and Sn-9Zn (SZ, in wt%) lead-free solders reacting with the Cu-40Zn alloys were investigated. The results were indicated that the (Cu, Zn)(6)Sn, and (Cu, Sn) Zn phases were formed in the Sn/Cu-40Zn couple reacted at 240 and 270 degrees C. When the reaction temperature was increased to 300 degrees C, the (Cu, Sn) Zn with the layered structure and metastable ternary Sn-ZnCu phase were observed at the interface. The similar results were found in the SAC/Cu-40Zn couples. The (Cu, Sn) Zn5 and (Cu, Sn)(5)Zn-8 phases were observed in the SZ/Cu-40Zn couples. When reaction temperature and time were increased, the (Cu, Sn)(5)Zn-8 phase with thick thickness was found at the interface.

引用

页码：549 / 550

页数：2

共 12 条

[1] Wettability and interfacial reactions of Sn-based Pb-free solders with Cu-xZn alloy under bump metallurgies [J].