Adaptive and Reliable Clock Distribution Design for 3-D Integrated Circuits

被引:6
作者
Chen, Xi [1 ]
Zhu, Ting [1 ]
Davis, William Rhett [1 ]
Franzon, Paul D. [1 ]
机构
[1] N Carolina State Univ, Dept Elect & Comp Engn, Raleigh, NC 27695 USA
来源
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2014年 / 4卷 / 11期
关键词
3-D integrated circuit (3-D IC); adaptive; clock distribution; deskew; optimization; process-voltage-temperature (PVT) variation; stacking; thermal profile; through-silicon-via (TSV); tunable-delay-buffer (TDB); PERFORMANCE; SKEW; ICS;
D O I
10.1109/TCPMT.2014.2361356
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
In this paper, we present novel techniques to handle the complexity and challenges in clock distribution for 3-D integrated circuit. First, we propose a novel active deskew technique to adaptively mitigate the cross-tier variations and the 3-D wiring asymmetry. The new deskew technique neither relies on an accurate through-silicon-vias model nor an accurate reference clock distribution. Second, we design a phase-mixer-based tunable-delay-buffer (TDB), which can be linearly tuned in 360 degrees and tolerant to process-voltage-termperature (PVT) variations. Third, based on the new deskew technique and TDB design, we propose an efficient clock distribution network topology, which can be realized without a need of balanced H-tree. Moreover, a thermal profile-based optimization flow is developed to further improve the power efficiency and reduce design overhead. A case study shows that the proposed techniques are able to largely improve the clock skews. The optimization flow is capable of reducing the design cost to achieve a better tradeoff of the skew performance and the design overhead.
引用
收藏
页码:1862 / 1870
页数:9
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