Study of gluing and wire bonding for the Belle II Silicon Vertex Detector

被引：1

作者：

Kang, K. H. ^{[1
]}

Hara, K. ^{[5
]}

Higuchi, T. ^{[2
]}

Hyun, H. J. ^{[1
]}

Jeon, H. B. ^{[1
]}

Joo, C. W. ^{[3
]}

Kah, D. H. ^{[4
]}

Kim, H. J. ^{[1
]}

Mibe, T. ^{[5
]}

Onuki, Y. ^{[6
]}

Park, H. ^{[1
]}

Rao, K. K. ^{[7
]}

Sato, N. ^{[5
]}

Shimizu, N. ^{[6
]}

Tanida, K. ^{[3
]}

Tsuboyama, T. ^{[5
]}

Uozumi, S. ^{[1
]}

机构：

[1] Kyungpook Natl Univ, Dept Phys, Taegu 702701, South Korea

[2] Univ Tokyo, Kavli IPMU WPI, Kashiwa, Chiba 2778583, Japan

[3] Seoul Natl Univ, Dept Phys, Seoul 151742, South Korea

[4] Agcy Def Dev, CBRN Directorate, Taejon 305600, South Korea

[5] KEK, High Energy Accelerator Res Org, Tsukuba, Ibaraki 3050801, Japan

[6] Univ Tokyo, Fac Sci, Dept Phys, Bunkyo Ku, Tokyo 1130033, Japan

[7] Tata Inst Fundamental Res, Expt High Energy Phys Grp, Bombay 400005, Maharashtra, India

来源：

NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT | 2014年 / 763卷

基金：

新加坡国家研究基金会;

关键词：

Gluing; Wire bonding; Belle II; Silicon Vertex Detector; Silicon sensor; Pitch adapter; TRACKER; DESIGN; CHIP;

D O I：

10.1016/j.nima.2014.06.053

中图分类号：

TH7 [仪器、仪表];

学科分类号：

0804 ; 080401 ; 081102 ;

摘要：

This paper describes an investigation into gluing and wire bonding for assembling the Silicon Vertex Detector (SVD) for the Belle II experiment at KEK in Japan. Optimizing the gluing of the silicon microstrip sensors, the support frame, and the readout Ilex cables is important for achieving the required mechanical precision. The wire bonding between the sensors and the readout electronic chips also needs special care to maximize the physics capability of the SVD. The silicon sensors and signal fan out Ilex circuits (pitch adapters) are glued and connected using wire bonding. We determine that gluing quality is important for achieving good bonding efficiency. The standard deviation in the glue thickness for the best result is measured to be 3.11 mu m. Optimal machine parameters for wire bonding are determined to be 70 mW power, 20 gf force, and 20 ms for the pitch adapter and GO mW power, 20 gf force, and 20 ms for the silicon strip sensors; these parameters provide a pull force of (10.92 +/- 0.72) gf. With these settings, 75% of the pitch adapters and 25% of the strip sensors experience the neck-broken type of break. (C) 2014 Elsevier B.V. All rights reserved.

引用

页码：255 / 259

页数：5

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