Gate Recessed Quasi-Normally OFF Al2O3/AlGaN/GaN MIS-HEMT With Low Threshold Voltage Hysteresis Using PEALD AlN Interfacial Passivation Layer

被引:113
作者
Hsieh, Ting-En [1 ]
Chang, Edward Yi [1 ,2 ]
Song, Yi-Zuo [1 ]
Lin, Yueh-Chin [1 ]
Wang, Huan-Chung [1 ]
Liu, Shin-Chien [1 ]
Salahuddin, Sayeef [3 ]
Hu, Chenming Calvin [3 ]
机构
[1] Natl Chiao Tung Univ, Dept Mat Sci & Engn, Hsinchu 300, Taiwan
[2] Natl Chiao Tung Univ, Dept Elect Engn, Hsinchu 300, Taiwan
[3] Univ Calif Berkeley, Dept Elect Engn & Comp Sci, Berkeley, CA 94720 USA
关键词
GaN; metal-insulator-semiconductor high electron-mobility transistor (MIS-HEMT); normally-OFF; gate recessed; gate insulator; threshold voltage hysteresis; Al2O3 and AlN; plasma enhanced atomic layer deposition (PE-ALD); interfacial passivation layer (IPL);
D O I
10.1109/LED.2014.2321003
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this letter, a gate recessed normally OFF AlGaN/GaN MIS-HEMT with low threshold voltage hysteresis using Al2O3/AlN stack gate insulator is presented. The trapping effect of Al2O3/GaN interface was effectively reduced with the insertion of 2-nm AlN thin interfacial passivation layer grown by plasma enhanced atomic layer deposition. The device exhibits a threshold voltage of +1.5 V, with current density of 420 mA/mm, an OFF-state breakdown voltage of 600 V, and high ON/OFF drain current ratio of similar to 10(9).
引用
收藏
页码:732 / 734
页数:3
相关论文
共 11 条
[1]  
Huang S., 2013, PHYS STATUS SOLIDI C, V50
[2]   Effective Passivation of AlGaN/GaN HEMTs by ALD-Grown AlN Thin Film [J].
Huang, Sen ;
Jiang, Qimeng ;
Yang, Shu ;
Zhou, Chunhua ;
Chen, Kevin J. .
IEEE ELECTRON DEVICE LETTERS, 2012, 33 (04) :516-518
[3]   Over 100 A operation normally-off AlGaN/GaN hybrid MOS-HFET on Si substrate with high-breakdown voltage [J].
Kambayashi, Hiroshi ;
Satoh, Yoshihiro ;
Ootomo, Shinya ;
Kokawa, Takuya ;
Nomura, Takehiko ;
Kato, Sadahiro ;
Chow, Tat-sing Pawl .
SOLID-STATE ELECTRONICS, 2010, 54 (06) :660-664
[4]   Enhancement-Mode GaN MIS-HEMTs With n-GaN/i-AlN/n-GaN Triple Cap Layer and High-k Gate Dielectrics [J].
Kanamura, Masahito ;
Ohki, Toshihiro ;
Kikkawa, Toshihide ;
Imanishi, Kenji ;
Imada, Tadahiro ;
Yamada, Atsushi ;
Hara, Naoki .
IEEE ELECTRON DEVICE LETTERS, 2010, 31 (03) :189-191
[5]   Characterization of VT-instability in enhancement-mode Al2O3-AlGaN/GaN MIS-HEMTs [J].
Lu, Yunyou ;
Yang, Shu ;
Jiang, Qimeng ;
Tang, Zhikai ;
Li, Baikui ;
Chen, Kevin J. .
PHYSICA STATUS SOLIDI C: CURRENT TOPICS IN SOLID STATE PHYSICS, VOL 10, NO 11, 2013, 10 (11) :1397-1400
[6]   Capacitance-Voltage Characteristics of Al2O3/AlGaN/GaN Structures and State Density Distribution at Al2O3/AlGaN Interface [J].
Mizue, Chihoko ;
Hori, Yujin ;
Miczek, Marcin ;
Hashizume, Tamotsu .
JAPANESE JOURNAL OF APPLIED PHYSICS, 2011, 50 (02)
[7]   AlGaN/GaN recessed MIS-gate HFET with high-threshold-voltage normally-off operation for power electronics applications [J].
Oka, Tohru ;
Nozawa, Tomohiro .
IEEE ELECTRON DEVICE LETTERS, 2008, 29 (07) :668-670
[8]   AlN Passivation Over AlGaN/GaN HFETs for Surface Heat Spreading [J].
Tsurumi, Naohiro ;
Ueno, Hiroaki ;
Murata, Tomohiro ;
Ishida, Hidetoshi ;
Uemoto, Yasuhiro ;
Ueda, Tetsuzo ;
Inoue, Kaoru ;
Tanaka, Tsuyoshi .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2010, 57 (05) :980-985
[9]   High-Performance Normally-Off Al2O3/GaN MOSFET Using a Wet Etching-Based Gate Recess Technique [J].
Wang, Ye ;
Wang, Maojun ;
Xie, Bing ;
Wen, Cheng P. ;
Wang, Jinyan ;
Hao, Yilong ;
Wu, Wengang ;
Chen, Kevin J. ;
Shen, Bo .
IEEE ELECTRON DEVICE LETTERS, 2013, 34 (11) :1370-1372
[10]   High-Quality Interface in Al2O3/GaN/AlGaN/GaN MIS Structures With In Situ Pre-Gate Plasma Nitridation [J].
Yang, Shu ;
Tang, Zhikai ;
Wong, King-Yuen ;
Lin, Yu-Syuan ;
Liu, Cheng ;
Lu, Yunyou ;
Huang, Sen ;
Chen, Kevin J. .
IEEE ELECTRON DEVICE LETTERS, 2013, 34 (12) :1497-1499