Thermal Stability of High Strength and High Conductivity Cu-Nb Microcomposites

被引：0

作者：

Liang Ming ^{[1
]}

Wang Pengfei ^{[1
]}

Xu Xiaoyan ^{[1
]}

Jiao Gaofeng ^{[1
]}

Li Chengshan ^{[1
]}

Zhang Pingxiang ^{[1
]}

机构：

[1] Northwest Inst Nonferrous Met Res, Xian 710016, Peoples R China

来源：

RARE METAL MATERIALS AND ENGINEERING | 2017年 / 46卷 / 02期

关键词：

Cu-Nb; high strength; high conductivity; thermal stability; COMPOSITES;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

High strength and high conductivity Cu-Nb microcomposites were fabricated by an accumulated bundling and drawing process. The crystal orientation and morphology of Cu-Nb materials under different HT conditions were investigated by X-ray diffraction and scanning electron microscopy. The change rules of strength and conductivity at different HT states were investigated by stress-strain and resistivity measurements. Results indicate that recrystallization textures are formed after HT at 700 degrees C. Chemical potential difference and atomic diffusion caused by serve plastic deformation are key factors of interface stability. And intermediate HT at 700 degrees C will be of great benefit to improve the mechanical properties of Cu-Nb microcomposites. It is believed that low temperature adjustment could improve the material plasticity and keep the material strength.

引用

页码：382 / 386

页数：5

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