Superhydrophobic and anti-corrosion Cu microcones/Ni-W alloy coating fabricated by electrochemical approaches

被引：10

作者：

Hu, Fengtian ^{[1
]}

Xu, Penghui ^{[1
]}

Wang, Haozhe ^{[2
]}

Kang, Un byoung ^{[3
]}

Hu, Anmin ^{[1
]}

Li, Ming ^{[1
]}

机构：

[1] Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, Key Lab Thin Film & Microfabricat Technol, State Key Lab Met Matrix Composites,Minist Educ, Shanghai 200240, Peoples R China

[2] MIT, Dept Mech Engn, Cambridge, MA 02139 USA

[3] Samsung Elect, Semicond Packaging Dev, Suwon, South Korea

来源：

RSC ADVANCES | 2015年 / 5卷 / 126期

基金：

中国国家自然科学基金;

关键词：

CORROSION-RESISTANCE; P FILMS; SURFACES; WATER; ELECTRODEPOSITION; MESHES; COPPER;

D O I：

10.1039/c5ra20638c

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

In this work, we present a simple method for fabricating a microstructured Cu/Ni-W alloy coating by combining electroless and electro deposition. Field emission scanning electron microscopy (FESEM) results show that a layer of Ni-W alloy has covered uniformly the conical surface of Cu microcone arrays, forming a multilayer coating. The Tafel curve shows the prominent anti-corrosion property of the as-deposited Ni-W film. Wettability results reveal that the water contact angles can be increased from 106 degrees to 153.2 degrees by adjusting the electrodeposition time of the Ni-W layer. The liquid-solid-air contact mode between the superhydrophobic Ni-W hemisphere decorated Cu microcone array and the water drop is briefly discussed. This work also showed potential for use in a wide range of applications, such as the commercial production of anti-wetting and anti-corrosion devices.

引用

页码：103863 / 103868

页数：6

共 26 条

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