Reliability of high temperature solder alternatives

被引：72

作者：

McCluskey, F. P. ^{[1
]}

Dash, M.

Wang, Z.

Huff, D.

机构：

[1] Univ Maryland, Dept Mech Engn, CALCE, EPSC, College Pk, MD 20742 USA

[2] Virginia Tech, Ctr Power Elect Syst, Blacksburg, VA USA

来源：

MICROELECTRONICS RELIABILITY | 2006年 / 46卷 / 9-11期

关键词：

D O I：

10.1016/j.microrel.2006.07.090

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

European RoHS directives, enacted in response to concerns about the toxicity of lead, are driving the substitution of Pb-free solders for Pb-containing solders at the component to board level. While European RoHS regulations currently exempt high Pb solders used as component solders and die attaches for automotive and other high temperature applications, there is a strong drive to find Pb-free alternatives for these high temperature electronic applications, as well. This paper presents constitutive and reliability information on one of the widely used high lead solder materials as a baseline, and discusses potential alternative technologies for high temperature solders with the goal of identifying a cost-effective lead-free solder that can be used at temperatures greater than 200 degrees C.

引用

页码：1910 / 1914

页数：5