Thermodynamic characteristics, microstructure and mechanical properties of Sn-0.7Cu-xIn lead-free solder alloy

被引：38

作者：

Tian, Shuang ^{[1
]}

Li, Saipeng ^{[1
]}

Zhou, Jian ^{[1
,2
]}

Xue, Feng ^{[1
,2
]}

机构：

[1] Southeast Univ, Jiangsu Key Lab Adv Metall Mat, Nanjing 211189, Jiangsu, Peoples R China

[2] Nanjing Inst Technol, Jiangsu Key Lab Adv Struct Mat & Applicat Technol, Nanjing 211189, Jiangsu, Peoples R China

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2018年 / 742卷

基金：

中国国家自然科学基金;

关键词：

Sn-Cu-In; Microstructure; Mechanical properties; Sawtooth; Stress relaxation; INTERMETALLIC COMPOUND LAYERS; TENSILE PROPERTIES; CU SUBSTRATE; STRAIN-RATE; AG CONTENT; GROWTH; TEMPERATURE; KINETICS; NI; ELEMENT;

D O I：

10.1016/j.jallcom.2018.01.386

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

The microstructure and mechanical properties of Sn-0.7Cu solder alloy and Sn-0.7Cu with 1.0e5.0 wt% indium addition were investigated in this study. With indium added into Sn-0.7Cu solder, the melting temperature decreased and the reaction temperature increased. Coarse grains of Cu-6(Sn,In)(5) intermetallic compounds (IMCs) were formed in the alloy matrix when the indium content increased to 1.0 wt%. Indium was evenly distributed in the beta-Sn phase and Cu-6(Sn,In)(5) IMCs in as-prepared In-containing solder alloys. After isothermal aging, indium accumulated gradually in the Cu-6(Sn,In)(5) IMCs while decreasing its content in the beta-Sn phase. Tensile test results indicated that the ultimate tensile strength increased obviously and that the elongation decreased significantly with indium addition. Sawtooths were observed in the stress-strain curves of all aged In-containing alloys. A model describing a coherent relationship between the beta-Sn phase and the Cu-6(Sn,In)(5) phase was proposed to explain this phenomenon. The fracture surface of the Sn-0.7Cu alloy exhibited a ductile fracture mode while a mixed ductile-brittle fracture mode occurred when excessive indium was added into Sn-0.7Cu alloys. (c) 2018 Elsevier B.V. All rights reserved.

引用

页码：835 / 843

页数：9

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