Grinding wheels for manufacturing of silicon wafers: A literature review

被引：76

作者：

Liu, J. H.

Pei, Z. J. ^{[1
]}

Fisher, Graham R.

机构：

[1] Kansas State Univ, Dept Ind & Mfg Syst Engn, Manhattan, KS 66506 USA

[2] MEMC Elect Mat Inc, St Peters, MO 63376 USA

来源：

INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE | 2007年 / 47卷 / 01期

基金：

美国国家科学基金会;

关键词：

abrasive; grinding wheel; machining; semiconductor material; silicon wafer;

D O I：

10.1016/j.ijmachtools.2006.02.003

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Grinding is an important process for manufacturing of silicon wafers. The demand for silicon wafers with better quality and lower price presents tremendous challenges for the grinding wheels used in the silicon wafer industry. The stringent requirements for these grinding wheels include low damage on ground surfaces, self-dressing ability, consistent performance, long wheel lives, and low prices. This paper presents a literature review on grinding wheels for manufacturing of silicon wafers. It discusses recent development in abrasives, bond materials, porosity formation, and geometry design of the grinding wheels to meet the stringent requirements. (C) 2006 Elsevier Ltd. All rights reserved.

引用

页码：1 / 13

页数：13

共 58 条

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