Vibration-induced fatigue life estimation of ball grid array packaging

Vibration loading has become very important in the reliability assessment of modern electronic systems. The objective of this paper is to develop a rapid assessment methodology that can determine the solder joint fatigue life of ball grid array (BGA) and chip scale packages (CSP) under vibration loading. The current challenge is how to execute the vibration fatigue life analysis rapidly and accurately. The approach in this paper will involve global (entire printed wiring board (PWB)) and local (particular component of interest) modeling approaches. In the global model approach, the vibration response of the PWB will be determined. This global model will give us the response of the PWB at specific component locations of interest. This response is then fed into a local stress analysis for accurate assessment of the critical stresses in the solder joints of interest. The stresses are then fed into a fatigue damage model to predict the life. The goal is to retain as much accuracy and physical insight as possible while retaining computation efficiency.