Pool boiling in saturated and subcooled HFE-7100 dielectric fluid from a porous graphite surface

被引:11
作者
El-Genk, MS [1 ]
Parker, JL [1 ]
机构
[1] Univ New Mexico, Inst Space & Nucl Power Studies, Albuquerque, NM 87131 USA
来源
ITHERM 2004, VOL 1 | 2004年
关键词
pool boiling; HFE-7100 dielectric liquid; immersion cooling of computer chips; porous graphite;
D O I
10.1109/ITHERM.2004.1319238
中图分类号
O414.1 [热力学];
学科分类号
摘要
Experiments investigated the effects of subcooling on pool boiling of HFE-7100 dielectric liquid from porous graphite measuring 10 x 10 mm and 3.0 mm thick. Results indicate no temperature excursion at incipient boiling and that subcooled nucleate boiling occurs at surface temperatures well below saturation. Conversely, for a smooth copper surface the temperature overshoot at incipient boiling is as much as 37.4 K in saturation and 7.5 - 16 K in subcooled nucleate boiling. Nucleate boiling ensues on the porous graphite at 0.8 K in saturation, and -2.0 to -11.7 K in subcooled boiling, compared to 5.0 to 10.9 K on the smooth copper surface. The nucleate boiling heat fluxes are more than 500% higher and the surface superheats are significantly lower than those for the copper surface in same experimental setup. The critical. heat flux (CHF) for the porous graphite surface is 31.8, 45.1, 55.9, and 66.4 W/cm(2) for saturation, 10 K, 20 K, and 30 K subcooled boiling, and the values for the smooth copper are 21.5, 28.1, 33.7, and 37.3 W/cm(2), respectively. In addition, the rate of increase in CHF for the porous graphite with increased subcooling similar to 50% higher than for the smooth copper surface.
引用
收藏
页码:655 / 662
页数:8
相关论文
共 31 条
[1]  
ARBELAEZ F, 2000, P NHTC 00 34 ANN NAT
[2]  
Arik M., 2001, P PAC RIM INT EL PAC
[3]   Towards optimizing enhanced surfaces for passive immersion cooled heat sinks [J].
Baldwin, CS ;
Bhavnani, SH ;
Jaeger, RC .
ITHERM '98: SIXTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, 1998, :399-408
[4]   Heater orientation effects on pool boiling of micro-porous-enhanced surfaces in saturated FC-72 [J].
Chang, JY ;
You, SM .
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 1996, 118 (04) :937-943
[5]   Enhanced boiling heat transfer from micro-porous cylindrical surfaces in saturated FC-87 and R-123 [J].
Chang, JY ;
You, SM .
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 1997, 119 (02) :319-325
[6]   Saturation boiling of HFE-7100 from a copper surface, simulating a microelectronic chip [J].
El-Genk, MS ;
Bostanci, H .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2003, 46 (10) :1841-1854
[7]   Combined effects of subcooling and surface orientation on pool boiling of HFE-7100 from a simulated electronic chip [J].
El-Genk, MS ;
Bostanci, H .
EXPERIMENTAL HEAT TRANSFER, 2003, 16 (04) :281-301
[8]  
GRIFFITH P, 1960, PROGR S SERIES, V49, P49
[9]   Advances in enhanced boiling heat transfer from electronic components [J].
Honda, H ;
Wei, J .
JSME INTERNATIONAL JOURNAL SERIES B-FLUIDS AND THERMAL ENGINEERING, 2003, 46 (04) :479-490
[10]   Enhanced boiling of FC-72 on silicon chips with micro-pin-fins and submicron-scale roughness [J].
Honda, H ;
Takamastu, H ;
Wei, JJ .
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME, 2002, 124 (02) :383-390