Inkjet printed SU-8 hemispherical microcapsules and silicon chip embedding

Planar lithography techniques are not effective for precise fabrication of microdevices with hemispherical shapes. Drop-on-demand (DOD) inkjet printing (IJP) of photo-curable ink is a more appropriate fabrication approach as it takes advantage of the surface tension as well as of the delivery of a well-defined ink volume. Described is a DOD IJP technique onto geometrically-patterned silicon substrates enabling the controlled fabrication of SU-8 hemispherical microcapsules. Open half capsules of 100 mu m in diameter with inner cavity volumes of 5, 20 and 45 pl with a printing yield above 96% are demonstrated. The same technique is directly adapted to the fabrication of microcapsules embedding silicon microchips. The reported findings open new paths for controlled encapsulation of liquids into smart microsystems.