Integrated circuit testing for quality assurance in manufacturing: History, current status, and future trends

被引:44
作者
Grochowski, A [1 ]
Bhattacharya, D [1 ]
Viswanathan, TR [1 ]
Laker, K [1 ]
机构
[1] UNIV PENN, DEPT ELECT ENGN, PHILADELPHIA, PA 19104 USA
关键词
D O I
10.1109/82.618036
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Integrated circuit (IC) testing for quality assurance is approaching 50% of the manufacturing costs for some complex mixed signal IC's, For many years the market growth and technology advancements in digital IC's were driving the developments in testing, The increasing trend to integrate information acquisition and digital processing on the same chip has spawned increasing attention to the test needs of mixed-signal IC's, The recent advances in wireless communications indicate a trend toward the integration of the RF and baseband mixed signal technologies, In this paper we examine the developments in IC testing form the historic, current status and future view points, In separate sections we address the testing developments for digital, mixed signal and RF IC's, With these reviews as context, we relate new test paradigms that have the potential to fundamentally alter the methods used to test mixed-signal and RF parts.
引用
收藏
页码:610 / 633
页数:24
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